K9F1208D0A SAMSUNG [Samsung semiconductor], K9F1208D0A Datasheet - Page 15

• Manufacturer Part Number: K9F1208D0A
• Description: 64M x 8 Bit , 32M x 16 Bit NAND Flash Memory
• Manufacturer: SAMSUNG [Samsung semiconductor]

AC CHARACTERISTICS FOR OPERATION
NOTE: 1. If reset command(FFh) is written at Ready state, the device goes into Busy for maximum 5us.
K9F1208D0A
K9F1208U0A
Data Transfer from Cell to Register
ALE to RE Delay
CLE to RE Delay
Ready to RE Low
RE Pulse Width
WE High to Busy
Read Cycle Time
RE Access Time
CE Access Time
RE High to Output Hi-Z
CE High to Output Hi-Z
RE or CE High to Output hold
RE High Hold Time
Output Hi-Z to RE Low
WE High to RE Low
Device resetting time(Read/Program/Erase)
K9F1208U0A-
Y,P,V,F or
K9F1208D0A-
Y,P only
2. To break the sequential read cycle, CE must be held high for longer time than tCEH.
3. The time to Ready depends on the value of the pull-up resistor tied R/B pin.
Parameter
Last RE High to Busy(at sequential read)
CE High to Ready(in case of interception by CE at read)
CE High Hold Time(at the last serial read)
K9F1216D0A
K9F1216U0A
Parameter
Symbol
t
t
t
t
t
t
t
t
t
WHR
t
t
CLR
t
t
t
REA
CEA
RHZ
CHZ
REH
RST
t
WB
OH
t
AR
RR
RP
RC
IR
R
K9F12XXD0A K9F12XXU0A K9F12XXD0A K9F12XXU0A
10
10
20
25
50
15
15
60
0
-
-
-
-
-
-
-
(2)
Min
15
10
10
20
25
50
15
15
60
0
-
-
-
-
-
-
-
Symbol
5/10/500
t
t
t
CRY
CEH
RB
100
12
30
45
30
20
-
-
-
-
-
-
-
-
-
(1)
Max
5/10/500
Min
100
-
-
100
12
30
45
30
20
FLASH MEMORY
-
-
-
-
-
-
-
-
-
(1)
50 +tr(R/B)
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
s
s
Max
100
-
(3)
Unit
ns
ns
ns