GS864218B-167IV GSI [GSI Technology], GS864218B-167IV Datasheet - Page 3

• Manufacturer Part Number: GS864218B-167IV
• Description: 4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs
• Manufacturer: GSI [GSI Technology]

GS864272C-xxxV 209-Bump BGA Pin Description
Rev: 1.03 6/2006
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
B
ADSP, ADSC
E
Symbol
, B
B
A
B
MCH
SCD
MCL
TMS
TDO
DQ
DQ
DQ
DQ
DQ
DQ
DQ
ADV
LBO
TCK
DQ
GW
BW
TDI
A
NC
CK
ZQ
0
An
C
ZZ
F
FT
E
E
E
G
, A
, B
, B
,B
1
3
2
C
D
G
H
A
B
E
F
D
1
B
G
,B
H
Type
I/O
—
O
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
(Low = Low Impedance [High Drive], High = High Impedance [Low Drive])
Byte Write Enable for DQ
3/35
Address Strobe (Processor, Cache Controller); active low
Single Cycle Deselect/Dual Cycle Deselect Mode Control
Address field LSBs and Address Counter Preset Inputs.
Burst address counter advance enable; active low
Global Write Enable—Writes all bytes; active low
Byte Write Enable for DQ
Byte Write Enable for DQ
Flow Through or Pipeline mode; active low
FLXDrive Output Impedance Control
Linear Burst Order mode; active low
Sleep Mode control; active high
Clock Input Signal; active high
Data Input and Output pins
Output Enable; active low
Chip Enable; active high
Chip Enable; active low
Chip Enable; active low
Byte Enable; active low
Scan Test Mode Select
Scan Test Data Out
Must Connect High
Must Connect Low
Scan Test Data In
Scan Test Clock
Description
Address Inputs
No Connect
E
, DQ
C
A
F
, DQ
, DQ
, DQ
G
B
D
, DQ
I/Os; active low
I/Os; active low
GS864218/36/72(B/C)-xxxV
H
I/Os; active low
© 2004, GSI Technology
Preliminary