GS864218B-167IV GSI [GSI Technology], GS864218B-167IV Datasheet - Page 7
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GS864218B-167IV
Manufacturer Part Number
GS864218B-167IV
Description
4M x 18, 2M x 36, 1M x 72 72Mb S/DCD Sync Burst SRAMs
Manufacturer
GSI [GSI Technology]
Datasheet
1.GS864218B-167IV.pdf
(35 pages)
GS864218/36B-xxxV 119-Bump BGA Pin Description
Rev: 1.03 6/2006
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
B
ADSP, ADSC
A
Symbol
, B
A
V
ADV
SCD
TMS
TDO
DQ
DQ
DQ
DQ
LBO
TCK
V
BW
GW
TDI
V
V
B
0
NC
CK
ZQ
An
ZZ
E
FT
DDQ
G
, B
, A
DD
SS
SS
1
A
B
C
D
1
C
, B
D
Type
I/O
—
O
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
FLXDrive Output Impedance Control (Low = Low Impedance [High Drive], High = High Impedance [Low
Byte Write Enable for DQ
Address Strobe (Processor, Cache Controller); active low
7/35
Single Cycle Deselect/Dual Cyle Deselect Mode Control
Address field LSBs and Address Counter Preset Inputs
Burst address counter advance enable; active low
Global Write Enable—Writes all bytes; active low
Byte Write—Writes all enabled bytes; active low
Flow Through or Pipeline mode; active low
Linear Burst Order mode; active low
Sleep mode control; active high
Clock Input Signal; active high
Data Input and Output pins
Output driver power supply
Output Enable; active low
Chip Enable; active low
Scan Test Mode Select
I/O and Core Ground
I/O and Core Ground
Scan Test Data Out
Core power supply
Scan Test Data In
Scan Test Clock
Address Inputs
Description
No Connect
A
, DQ
Drive])
B
, DQ
C
, DQ
D
GS864218/36/72(B/C)-xxxV
I/Os; active low
© 2004, GSI Technology
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