LIS331DL_08 STMICROELECTRONICS [STMicroelectronics], LIS331DL_08 Datasheet - Page 17

• Manufacturer Part Number: LIS331DL_08
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

LIS331DL
4
4.1
Application hints
Figure 5.
The device core is supplied through Vdd line while the I/O pads are supplied through
Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 µF Al) should be
placed as near as possible to the pin 14 of the device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to
without blocking the communication bus, in this condition the measurement chain is
powered off.
The functionality of the device and the measured acceleration data is selectable and
accessible through the I
The functions, the threshold and the timing of the two interrupt pins (INT 1 and INT 2) can be
completely programmed by the user through the I
Soldering information
The LGA package is compliant with the ECOPACK
qualified for soldering heat resistance according to JEDEC J-STD-020C.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendation are available at www.st.com/mems.
Vdd
LIS331DL electrical connection
Digital signal from/to signal controller.Signal’s levels are defined by proper selection of Vdd_IO
10µF
100nF
GND
2
C/SPI interface.When using the I
Vdd_IO
Figure
5). It is possible to remove Vdd maintaining Vdd_IO
5
1
TOP VIEW
2
C/SPI interface.
®
, RoHS and “Green” standard. It is
2
C, CS must be tied high.
13
9
INT 2
INT 1
Application hints
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