LIS331DL_08 STMICROELECTRONICS [STMicroelectronics], LIS331DL_08 Datasheet - Page 40

• Manufacturer Part Number: LIS331DL_08
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Package information
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40/42
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK
ECOPACK
Figure 25. LGA 16: Mechanical data and package dimensions
Ref.
A1
A2
A3
D1
E1
N1
N2
P1
P2
L1
L2
T1
T2
M
d
k
®
specifications are available at: www.st.com.
2.850 3.000 3.150 0.1122 0.1181 0.1240
2.850 3.000 3.150 0.1122 0.1181 0.1240
0.040 0.100 0.160 0.0016 0.0039 0.0063
0.290 0.350 0.410 0.0114 0.0138 0.0161
0.190 0.250 0.310 0.0075 0.0098 0.0122
Min.
0.785
0.200
1.000 1.060
2.000 2.060
0.500
1.000
0.875
1.275
0.150
0.050
Typ. Max. Min.
mm
Dimensions
1.000
®
is an ST trademark.
0.0309
0.0079
0.0394 0.0417
0.0787 0.0811
0.0197
0.0394
0.0344
0.0502
0.0059
0.0020
Typ.
inch
0.0394
Max.
Land Grid Array Package
LGA16 (3x3x1.0mm)
mechanical data
Outline and
7983231
LIS331DL
®