HX6656 ETC1 [List of Unclassifed Manufacturers], HX6656 Datasheet - Page 10

• Manufacturer Part Number: HX6656
• Description: 32K x 8 ROM-SOI
• Manufacturer: ETC1 [List of Unclassifed Manufacturers]

HX6656
28-LEAD FLAT PACK
28-LEAD DIP
Q
For 28-Lead DIP description, see MIL-STD-1835, Type CDIP2-T28, Config. C, Dimensions D-10
G
L
1
A
W
(22017785-001)
X
Y
Lid [4]
Kovar
VIEW
TOP
E2
E
(22017842-001)
Capacitor
Pads
Ceramic
Body
E3
C
Alloy 42 [3]
U
(width)
Lead
(pitch)
b
e
S
10
BOTTOM
VIEW
Index
[1] BSC – Basic lead spacing between centers
[2] Where lead is brazed to package
[3] Parts delivered with leads unformed
[4] Lid connected to VSS
1
All dimensions in inches
E2
E3
W
A
C
D
E
G
Q
S
U
X
Y
b
e
F
L
0.105 ± 0.015
0.017 ± 0.002
0.003 to 0.006
0.720 ± 0.008
0.050 ± 0.005 [1]
0.500 ± 0.007
0.380 ± 0.008
0.060 ref
0.650 ± 0.005 [2]
0.035 ± 0.004
0.295 min [3]
0.026 to 0.045
0.045 ± 0.010
0.130 ref
0.050 ref
0.075 ref
0.010 ref