IS75V16F128GS32-7065BI ISSI [Integrated Silicon Solution, Inc], IS75V16F128GS32-7065BI Datasheet

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IS75V16F128GS32-7065BI

Manufacturer Part Number
IS75V16F128GS32-7065BI
Description
3.0 Volt Multi-Chip Package (MCP) 128 Mbit Simultaneous Operation Flash Memory and 32 Mbit Pseudo Static RAM
Manufacturer
ISSI [Integrated Silicon Solution, Inc]
Datasheet
MCP FEATURES
FLASH FEATURES
IS75V16F128GS32
3.0 Volt Multi-Chip Package (MCP)
— 128 Mbit Simultaneous Operation Flash
Memory and 32 Mbit Pseudo Static RAM
• User Configurable Banks
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products. FlexBankTM is a trademark
of Fujitsu Limited, Japan. Embedded Erase
Integrated Silicon Solution, Inc. — www.issi.com —
PRELIMINARY INFORMATION Rev. 00D
03/24/03
Power Dissipation:
Power supply voltage 2.7V to 3.3V
High performance:
Flash: 70ns maximum access time
PSRAM: 65ns maximum access time
Package: 107-ball BGA
Operating Temperature: -30C to +85C
Read Current at 1 Mhz: 4 mA maximum
Read Current at 5 Mhz:18 mA maximum
Sleep Mode: 5 A maximum
Flash 1 (64 Mbit)
Bank A1: 8Mbit (8KB x 8 and 64KB x 15)
Bank B1: 24Mbit (64KB x 48)
Bank C1: 24Mbit (64KB x 48)
Bank D1: 8Mbit (8KB x 8 and 64KB x 15)
Flash 2 (64 Mbit)
Bank A2: 8Mbit (8KB x 8 and 64KB x 15)
Bank B2: 24Mbit (64KB x 48)
Bank C2: 24Mbit (64KB x 48)
Bank D2: 8Mbit (8KB x 8 and 64KB x 15)
User chooses two virtual banks from a
combination of four physical banks
Simultaneous R/W Operations (dual virtual bank):
Zero latency between read and write operations; Data
can be programmed or erased in one bank while data
is simultaneously being read from the other bank
Low-Power Mode:
A period of no activity causes flash to enter a
low-power state
Erase Suspend/Resume:
Suspends of erase activity to allow a read in the
same bank
Sector Erase Architecture:
16 sectors of 4K words each and 126 sectors of 32K words
each in Word mode. Any combination of sectors, or
the entire flash can be simultaneously erased
TM
and Embedded Program
TM
are trademarks of Advanced Micro Devices, Inc
1-800-379-4774
PSRAM FEATURES (32 Mb density)
Erase Algorithms:
Automatically preprograms/erases the flash memory
entirely, or by sector
Program Algorithms:
Automatically writes and verifies data at specified
address
Hidden ROM Region:
256 byte with a Factory-serialized secure electronic
serial number (ESN), which is accessible through a
command sequence
Data Polling and Toggle Bit:
Detects the completion of the program or erase cycle
Ready-Busy Outputs (RY/BY)
Detection of program or erase cycle completion for
each flash chip
Over 100,000 write/erase cycles
Low supply voltage (Vccf
WP/ACC input pin:
If V
If V
If Vacc, program time is improved
Power Dissipation:
Operating: 25 mA maximum
Standby: 110 µA maximum
Chip Selects: CE1r, CE2r
Power down feature using CE2r
Sleep Mode: 10 µA maximum
Nap: 65 µA maximum
8 mbit Partial: 80 µA maximum
Data retention supply voltage: 2.1 V to 3.3V
Byte data control: LB (DQ0–DQ7), UB
(DQ8–DQ15)
IL
IH
, allows partial protection of boot sectors
, allows removal of boot sector protection
PRELIMINARY INFORMATION
2.5V) inhibits writes
MARCH 2003
ISSI
®
1

Related parts for IS75V16F128GS32-7065BI

IS75V16F128GS32-7065BI Summary of contents

Page 1

... IS75V16F128GS32 3.0 Volt Multi-Chip Package (MCP) — 128 Mbit Simultaneous Operation Flash Memory and 32 Mbit Pseudo Static RAM MCP FEATURES • Power supply voltage 2.7V to 3.3V • High performance: Flash: 70ns maximum access time PSRAM: 65ns maximum access time • Package: 107-ball BGA • ...

Page 2

... IS75V16F128GS32 GENERAL DESCRIPTION This 107-ball MCP is a space-saving combination of 3 memories: two 64Mbit Flash and one 32Mbit Pseudo SRAM. Each 64Mbit Flash (Flash1 and Flash 2) contains 4,194,304 words and the 32Mbit PSRAM contains 2,097,152 words. Each word is 16 bits wide. Data lines DQ0-DQ15 handle the access for all three memories. Write Enable, Output Enable, and A0-A20 are shared among the three memories ...

Page 3

... IS75V16F128GS32 PIN CONFIGURATION (128 Mb Flash and 32 Mb PSRAM) PACKAGE CODE: B 107 BALL FBGA (Top View) (9. 10.00 mm Body, 0.8 mm Ball Pitch GND GND H NC CEf1 OE J CE1r ...

Page 4

... IS75V16F128GS32 DEVICE BUS OPERATION CE2r OE (1,2) OPERATION Full Standby Output Disable ( (4) Read from FLASH Read from FLASH 2 ...

Page 5

... IS75V16F128GS32 ABSOLUTE MAXIMUM RATINGS Symbol Parameter Tstg Storage Temperature T Ambient Temperature with Power Applied Voltage with Respect to Ground All Pins IN OUT ( Supply ( Supply CC CC RESET1, RESET2 V IN WP/ACC (4) V ACC Notes: 1. Voltage is defined on the basis of GND = 0 V. ...

Page 6

... IS75V16F128GS32 DC CHARACTERISTICS Symbol Parameter I Input Leakage LI I Output Leakage LO RESET Inputs I LIT Leakage Current I 1f FLASH Vcc (1) CC Active Current (Read FLASH Vcc Active (2) CC Current(Program/Erase) OE FLASH Vcc Active (5) CC Current (Read-While-Program) ( FLASH Vcc Active CC Current (Read-While-Erase ...

Page 7

... IS75V16F128GS32 DC CHARACTERISTICS (Continued) Symbol Parameter I r PSRAM V Power Down Current (8) (8M Partial) V Input Low Level IL V Input High Level (FLASH 1 or FLASH Input High Level (PSRAM Voltage for Sector Protection ID and Temp. Unprotection(RESET) Voltage for WP/ACC V ACC Sector Protection/Unprotection ...

Page 8

... IS75V16F128GS32 AC CHARACTERISTICS - TIMING CE CE Parameter CEf Recover Time CEf Hold Time CE1r High to WE Invalid time for Standby Entry TIMING DIAGRAM FOR ALTERNATING PSRAM TO CEf CE1r WE CE2r 8 Symbol Condition t — CCR t — CHOLD t — CHWX FLASH CCR t CHOLD t CHWX ...

Page 9

... IS75V16F128GS32 FLEXIBLE SECTOR-ERASE ARCHITECTURE ON FLASH 1 or FLASH 2 Sector Bank Address K-Word Bank A SA0 4 Bank A SA1 4 Bank A SA2 4 Bank A SA3 4 Bank A SA4 4 Bank A SA5 4 Bank A SA6 4 Bank A SA7 4 Bank A SA8 32 Bank A SA9 32 Bank A SA10 32 Bank A SA11 32 Bank A SA12 32 Bank A SA13 32 Bank A SA14 ...

Page 10

... IS75V16F128GS32 FLEXIBLE SECTOR-ERASE ARCHITECTURE ON FLASH 1 or FLASH 2 Sector Bank Address K-Word Bank C SA72 32 Bank C SA73 32 Bank C SA74 32 Bank C SA75 32 Bank C SA76 32 Bank C SA77 32 Bank C SA78 32 Bank C SA79 32 Bank C SA80 32 Bank C SA81 32 Bank C SA82 32 Bank C SA83 32 Bank C SA84 32 Bank C SA85 32 Bank C SA86 ...

Page 11

... IS75V16F128GS32 USER CONFIGURABLE BANK ARCHITECTURE TABLE - FLASH 1 or FLASH 2 Virtual Bank 1 Bank Split Volume Choice 1 8 Mbit Choice 2 24 Mbit Choice 3 24 Mbit Choice 4 8 Mbit EXAMPLE OF VIRTUAL BANKS COMBINATION TABLE - FLASH 1 or FLASH 2 Virtual Bank 1 Bank Split Volume Combination Choice 1 ...

Page 12

... IS75V16F128GS32 SIMULTANEOUS OPERATION TABLE - FLASH 1 or FLASH 2 Case Note writing erase suspend command on the bank address of sector being erased, the erase operation gets suspended so that it enables reading from or programming the remaining sectors. 2) Bank 1 and Bank 2 are divided for the sake of convenience at Simultaneous Operation. Actually, the Bank consists of 4 banks, Bank A, Bank B, Bank C, and Bank D ...

Page 13

... IS75V16F128GS32 SECTOR ADDRESS TABLE - FLASH 1 or FLASH 2 Bank Address Bank Sector A 21 Bank A SA0 0 Bank A SA1 0 Bank A SA2 0 Bank A SA3 0 Bank A SA4 0 Bank A SA5 0 Bank A SA6 0 Bank A SA7 0 Bank A SA8 0 Bank A SA9 0 Bank A SA10 0 Bank A SA11 0 Bank A SA12 0 Bank A SA13 0 Bank A ...

Page 14

... IS75V16F128GS32 SECTOR ADDRESS TABLE - FLASH 1 or FLASH 2 Bank Address Bank Sector A 21 Bank B SA33 0 Bank B SA34 0 Bank B SA35 0 Bank B SA36 0 Bank B SA37 0 Bank B SA38 0 Bank B SA39 0 Bank B SA40 0 Bank B SA41 0 Bank B SA42 0 Bank B SA43 0 Bank B SA44 0 Bank B SA45 0 Bank B SA46 0 Bank B ...

Page 15

... IS75V16F128GS32 SECTOR ADDRESS TABLE - FLASH 1 or FLASH 2 Bank Address Bank Sector A 21 Bank B SA66 0 Bank B SA67 0 Bank B SA68 0 Bank B SA69 0 Bank B SA70 0 Bank C SA71 1 Bank C SA72 1 Bank C SA73 1 Bank C SA74 1 Bank C SA75 1 Bank C SA76 1 Bank C SA77 1 Bank C SA78 1 Bank C SA79 1 Bank C ...

Page 16

... IS75V16F128GS32 SECTOR ADDRESS TABLE - FLASH 1 or FLASH 2 Bank Address Bank Sector A 21 Bank C SA100 1 Bank C SA101 1 Bank C SA102 1 Bank C SA103 1 Bank C SA104 1 Bank C SA105 1 Bank C SA106 1 Bank C SA107 1 Bank C SA108 1 Bank C SA109 1 Bank C SA110 1 Bank C SA111 1 Bank C SA112 1 Bank C SA113 1 Bank C ...

Page 17

... IS75V16F128GS32 SECTOR ADDRESS GROUP TABLE - FLASH 1 or FLASH 2 Sector SGA0 SGA1 SGA2 SGA3 SGA4 SGA5 SGA6 SGA7 SGA8 SGA9 SGA10 SGA11 SGA12 SGA13 SGA14 ...

Page 18

... IS75V16F128GS32 SECTOR ADDRESS GROUP TABLE - FLASH 1 or FLASH 2 Sector SGA33 SGA34 SGA35 SGA36 SGA37 SGA38 SGA39 SGA40 SGA41 SGA42 SGA43 SGA44 SGA45 SGA46 SGA47 ...

Page 19

... IS75V16F128GS32 FLASH MEMORY COMMAND DEFINITIONS - FLASH 1 or FLASH 2 Bus First Bus Command Cycle Write Sequence Cycle Req'd Addr. 1 (1) XXXh Read / Reset (1) Read / Reset 3 555h Autoselect 3 555h 4 555h Program 1 BA Program Suspend BA 1 Program Resume 6 Chip Erase 555h 6 555h Sector Erase ...

Page 20

... IS75V16F128GS32 FLASH MEMORY COMMAND DEFINITIONS - FLASH 1 or FLASH 2 Notes: • Address bits A21 to A11 = X = “H” or “L” for all address commands except or Program Address (PA), Sector Address (SA), and Bank Address (BA), and Sector Group Address (SPA). • Bus operations are defined in "DEVICE BUS OPERATIONS” ...

Page 21

... IS75V16F128GS32 FLASH READ ONLY OPERATIONS CHARACTERISTICS - FLASH 1 or FLASH 2 Parameter Read Cycle Time Address to Output Delay Chip Enable to Output Delay Output Enable to Output Delay Chip Enable to Output High-Z Output Enable to Output High-Z Output Hold Time From Addresses, CEf or OE, Whichever Occurs First ...

Page 22

... IS75V16F128GS32 FLASH READ CYCLE - FLASH 1 or FLASH 2 Address CEf1 OE WE High Address Stable t ACC OEH t CE Integrated Silicon Solution, Inc. — www.issi.com — ISSI High-Z Output valid 1-800-379-4774 PRELIMINARY INFORMATION Rev. 00D 03/24/03 ® ...

Page 23

... IS75V16F128GS32 RESET RESET / READ OPERATION TIMING DIAGRAM - FLASH 1 or FLASH 2 RESET FLASH HARDWARE RESET RESET Address CEf1 RESET High-Z DQ Integrated Silicon Solution, Inc. — www.issi.com — PRELIMINARY INFORMATION Rev. 00D 03/24/ Address Stable t ACC 1-800-379-4774 ISSI t OH Output valid ® ...

Page 24

... IS75V16F128GS32 FLASH WRITE/ERASE/PROGRAM OPERATIONS - FLASH 1 or FLASH 2 Parameter Write Cycle Time Address Setup Time Address Setup Time to OE Low During Toggle Bit Polling Address Hold Time Address Hold Time from High During Toggle Bit Polling Data Setup Time Data Hold Time ...

Page 25

... IS75V16F128GS32 FLASH WRITE/ERASE/PROGRAM OPERATIONS - FLASH 1 or FLASH 2 Parameter OE Setup Time to WE Active (2) CE Setup Time to WE Active (2) f Recover Time from RY/BY RESET Pulse Width RESET High Level Period Before Read Program/Erase Valid to RY/BY Delay Delay Time from Embedded Output Enable Erase Time-Out Time ...

Page 26

... IS75V16F128GS32 FLASH WRITE CYCLE - FLASH 1 or FLASH 2 (WE CONTROL) 3rd Bus Cycle 555h ADDRESS t WC CEf GHWL WE DQ Notes address of the memory location to be programmed data to be programmed at byte address. 3. DQ7 is the output of the complement of the data written to the device. ...

Page 27

... IS75V16F128GS32 FLASH WRITE CYCLE - FLASH 1 or FLASH 2 (CEf CONTROL) 3rd Bus Cycle 555h ADDRESS CEf1 GHEL WE DQ Notes address of the memory location to be programmed data to be programmed at byte address. 3. DQ7 is the output of the complement of the data written to the device. ...

Page 28

... IS75V16F128GS32 FLASH AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS - FLASH 1 or FLASH 2 ADDRESS CEf1 GHWL VCS Vccf Notes the sector address for Sector Erase. Address = 555h for Chip Erase 555h 2AAh 555h WPH ...

Page 29

... IS75V16F128GS32 FLASH AC WAVEFORMS FOR DATA DURING EMBEDDED ALGORITHM OPERATIONS - FLASH 1 or FLASH 2 CEf1 Data / Data In t RY/BY Notes: DQ7 = Valid Data (the device has completed the Embedded operation Integrated Silicon Solution, Inc. — www.issi.com — PRELIMINARY INFORMATION Rev. 00D ...

Page 30

... IS75V16F128GS32 FLASH AC WAVEFORMS FOR TOGGLE BIT DURING EMBEDDED ALGORITHM OPERATIONS - FLASH 1 or FLASH 2 ADDRESS CEf1 WE t OEH /DQ Data BUSY RY/BY Notes: 1 DQ6 stops toggling (the device has completed the Embedded operation AHT ASO AHT AS t CEPH t OEPH ...

Page 31

... IS75V16F128GS32 FLASH BACK-to-BACK READ/WRITE TIMING DIAGRAM - FLASH 1 or FLASH 2 Read t RC BA1 ADDRESS CEf1 OE t GHWL WE Valid DQ Output Note: 1. This is example of Read for Bank 1 and Embedded Algorithm (program) for Bank 2. BA1: Address of Virtual Bank 1. BA2: Address of Virtual Bank 2. Integrated Silicon Solution, Inc. — www.issi.com — ...

Page 32

... IS75V16F128GS32 TIMING DIAGRAM FLASH RY/BY DURING WRITE/ERASE OPERATIONS - FLASH 1 or FLASH 2 CEf WE RY/BY FLASH RESET, RESET, RESET, RESET, RY/BY RESET TIMING DIAGRAM - FLASH 1 or FLASH RESET RY/BY 32 The rising edge of the last write pulse Entire programming or erase operations t BUSY READY Integrated Silicon Solution, Inc. — ...

Page 33

... IS75V16F128GS32 FLASH TEMPORARY SECTOR GROUP UNPROTECTION - FLASH 1 or FLASH 2 t VCCf VIDR t VCS VID 3V RESET CEf1 WE RY/BY Integrated Silicon Solution, Inc. — www.issi.com — PRELIMINARY INFORMATION Rev. 00D 03/24/03 t VLHT Program or Erase Command Sequence Unprotection Period 1-800-379-4774 ISSI ® t VLHT t VLHT 33 ...

Page 34

... IS75V16F128GS32 FLASH ACCELERATED PROGRAM - FLASH 1 or FLASH 2 VCCf t VCS VACC VIH WP/ACC CEf1 WE RY/ VACCR t VLHT Program Command Sequence Acceleration Period Integrated Silicon Solution, Inc. — www.issi.com — ISSI ® t VLHT t VLHT 1-800-379-4774 PRELIMINARY INFORMATION Rev. 00D 03/24/03 ...

Page 35

... IS75V16F128GS32 FLASH EXTENDED SECTOR GROUP PROTECTION- FLASH 1 or FLASH 2 t VCS Vccf t VLHT RESET t VIDR Address A6 CEf1 OE WE Data Notes: 1 SPAX : Sector Group Address to be protected, SPAY : Next Group Sector Address to be protected, . TIME-OUT: Time-Out window Integrated Silicon Solution, Inc. — www.issi.com — ...

Page 36

... IS75V16F128GS32 FLASH ERASE AND PROGRAMMING PERFORMANCE - FLASH 1 or FLASH 2 Parameter Sector Erase Time Word Programming Time Chip Programming Time Erase/Program Cycle Note: 1. Typical Erase conditions TA = 25°C, VCCf_1 & VCCf_2 = 2.9V. Typical Program conditions TA = 25°C, VCCf_1 & VCCf_2 = 2.9V. Data= Checker 36 Min. ...

Page 37

... IS75V16F128GS32 PSRAM POWER DOWN PROGRAM KEY TABLE Basic KEY Table Definition A16 KEY Mode Select Available KEY Table A16 MODE Mode Select NAP Partial H SLEEP H Notes: 1: The Power Down Program can be performed one time after compliance of Power-up timings and it should not be re-programmed after regular Read or Write ...

Page 38

... IS75V16F128GS32 PSRAM READ OPERATIONS Parameter Read Cycle Time (1,3) Chip Enable Access Time (1) Output Enable Access Time (1,4) Address Access Time (1) Output Data Hold Time CE1r Low to Output Low-Z (2) OE Low to Output Low-Z (2) CE1r High to Output High-Z (2) OE High to Output High-Z (2) Address Setup Time to CE1r Low ...

Page 39

... IS75V16F128GS32 PSRAM WRITE OPERATIONS Parameter Write Cycle Time (1) Address Setup Time (2) (2) Address Hold Time CE1r Write Setup Time CE1r Write Hold Time WE Setup Time WE Hold Time LB adnd UB Setup Time LB adnd UB Hold Time OE Setup Time (3) OE Hold Time (3,4) OE Hold Time (5) OE High to CE1r Low Setup Time ...

Page 40

... IS75V16F128GS32 PSRAM POWER DOWN PARAMETERS Parameter CE2r Low Setup Time for Power down Entry CE2r Low Hold Time after Power down Entry CE1r High Hold Time Following CE2r High after Power down Exit SLEEP Mode only CE1r High Setup Time following CE2r High after Power down Exit ...

Page 41

... IS75V16F128GS32 PSRAM READ TIMING (OE Control Access) ADDRESS CE1r (Output) Note: CE2r, PE and WE must be High during read cycle. Either or both LB and UB must be Low when both CE1r and OE are Low. PSRAM READ TIMING (CE1r Control Access) ADDRESS t ASC CE1r OE t BSC ...

Page 42

... IS75V16F128GS32 (Address Access after OE Control Access) PSRAM READ TIMING ADDRESS (A20-A3) ADDRESS (A2-A0) CE1r (Output) Note: CE2r, PE and WE must be High during read cycle. Either or both LB and UB must be Low when both CE1r and OE are Low. (Address Access after CE1r Control Access) ...

Page 43

... IS75V16F128GS32 PSRAM WRITE TIMING (CE1r Control) Address t AS CE1r UB OHCL OE DQ (Input) Note: CE2r and PE must be High during write cycle. PSRAM WRITE TIMING (WE Control, Single Write Operation) Address CE1r WE UB (Input) Note: CE2r and PE must be High during write cycle. ...

Page 44

... IS75V16F128GS32 PSRAM WRITE TIMING (WE Control, Continuous Write Operation) ADDRESS CE1r WE UB (Input) Note: CE2r and PE must be High during write cycle. PSRAM READ / WRITE TIMING ADDRESS t CE1r WE t CHBH UB Read Data Output Note: Write address is valid from either CE1r last falling edge. ...

Page 45

... IS75V16F128GS32 PSRAM READ / WRITE TIMING ADDRESS CE1r WE UB Write Data Input Note: The t is specified from the time satisfied oth t OEH PSRAM READ / WRITE TIMING ADDRESS Low CE1r WE UB Read Data Output Note: CE1r can be tied to Low for WE and OE controlled operation. When CE1r is tied to Low, output is exclusively controlled by OE. Integrated Silicon Solution, Inc. — ...

Page 46

... IS75V16F128GS32 PSRAM READ / WRITE TIMING Address CE1r Low WE UB Write Data Input Note: CE1r can be tied to Low for WE and OE controlled operation. When CE1r is tied to Low, output is exclusively controlled OE. 46 (READ = OE Control, WRITE = WE Control Read Address t ASO t t OEH ...

Page 47

... IS75V16F128GS32 PSRAM POWER DOWN TIMING CE1r PE ADDRESS A20-A16 Note: CE2r must be High for Power Down Programming. Any other inputs not specified above can be either High or Low. PSRAM STANDBY ENTRY and EXIT TIMING CE1r CE2r DQ Power Down Entry Note: This Power Down mode can be also used for Power-up Timing #2 except that t Power-up Timing. Integrated Silicon Solution, Inc. — ...

Page 48

... IS75V16F128GS32 PSRAM POWER UP TIMING 1 CE1r CE2r Note: The C2LH specifies after Vccr reaches specfied minimum level. PSRAM POWER UP TIMING 2 CE1r CE2r Vccr 0 V C2HL specifies from CE2r Low to High transition after Vccr reaches specified minimum level. CE1r must t Note: The be brought to High prior to or together with CE2r Low to High transition ...

Page 49

... IS75V16F128GS32 PSRAM DATA RETENTION SWITCHING CHARACTERISTICS Symbol Parameter V Vccr Data Retention Supply Voltage DR I Vccr Data Retention Supply Current Vccr Data Retention Supply Current DR t Data Retention SetupTime DRS t Data Retention RecoveryTime DRR Voltage Transition Time CCR Note ...

Page 50

... IS75V16F128GS32 PIN CAPACITANCE Symbol Parameter C Input Capacitance IN C Output Capacitance OUT C 2 Control Pin Capacitance IN Notes: 1. Test conditions T = +25 ° 1.0 MHz A HANDLING OF PACKAGE: Please handle this package carefully because the sides of the package have acute angles. CAUTION: 1) The high voltage (VID) cannot be applied to address pins and control pins except RESET. Exception is when autoselect and sector group protection function are used. Then the high voltage (VID) can be applied to RESET. 2) Without the high voltage (VID) sector group protection can be achieved by using the “ ...

Page 51

... IS75V16F128GS32 MINI BALL GRID ARRAY – 107-Ball BGA PACKAGE CODE: B (9. 10.00 mm Body, 0.8 mm Ball Pitch SEATING PLANE Symbol Min. Typ. A 1.15 1.25 A1 0.05 0.10 D 9.90 10.00 D1 — 8.80 E 8.90 9.00 E1 — 7.20 e — 0.80 Integrated Silicon Solution, Inc. — www.issi.com — ...

Page 52

... IS75V16F128GS32 ORDERING INFORMATION o Industrial Range: - +85 Flash Bank Order Part No. Organization IS75V16F128GS32-7065BI User Configurable Flash Speed(ns) 70 Integrated Silicon Solution, Inc. — www.issi.com — ISSI PSRAM Speed(ns) Package 65 107-ball BGA 1-800-379-4774 PRELIMINARY INFORMATION Rev. 00D ® 03/24/03 ...

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