C8051F962-A-GM Silicon Labs, C8051F962-A-GM Datasheet - Page 48
C8051F962-A-GM
Manufacturer Part Number
C8051F962-A-GM
Description
8-bit Microcontrollers - MCU 128KB, DC-DC, AES DQFN76
Manufacturer
Silicon Labs
Datasheet
1.C8051F960-A-GQ.pdf
(492 pages)
Specifications of C8051F962-A-GM
Rohs
yes
Core
8051
Processor Series
C8051
Data Bus Width
8 bit
Maximum Clock Frequency
25 MHz
Program Memory Size
128 KB
Data Ram Size
8448 B
On-chip Adc
Yes
Operating Supply Voltage
2.5 V to 3.3 V
Operating Temperature Range
- 40 C to + 85 C
Package / Case
DQFN-76
Mounting Style
SMD/SMT
Number Of Programmable I/os
57
Number Of Timers
4
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C8051F96x
3.1.3. Soldering Guidelines
3.1.3.1. Solder Mask Design
All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the
metal pad is to be 60 m minimum, all the way around the pad.
3.1.3.2. Stencil Design
3.1.3.3. Card Assembly
3.1.3.4. Inner via placement
48
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
4. A 2x2 array of 1.25 mm square openings on 1.60 mm pitch should be used for the center ground
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
1. Inner via placement per Figure 3.6.
2. Reccomended via hole size is 0.150 mm (6 mil) laser drilled holes.
assure good solder paste release.
pad.
Components.
Rev. 0.5
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