M24C02-WBN6P STMicroelectronics, M24C02-WBN6P Datasheet
M24C02-WBN6P
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M24C02-WBN6P
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M24C02-WBN6P Summary of contents
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... M24C08 M24C08-R M24C04-W M24C04 M24C04-R M24C02-W M24C02 M24C02-R M24C01-W M24C01 M24C01-R January 2006 M24C04, M24C02, M24C01 Figure 1. Packages Part Number M24C16, M24C08 PDIP8 (BN) SO8 (MN) 150 mil width TSSOP8 (DW) 169 mil width TSSOP8 (DS) 3x3mm² body size (MSOP) UFDFPN8 (MB) 2x3mm² (MLP) ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 TABLE OF CONTENTS FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 1. Product List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 1. Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 SUMMARY DESCRIPTION Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Table 2. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Figure 3. 8-Pin Package Connections (Top View SIGNAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Serial Clock (SCL Serial Data (SDA Chip Enable (E0, E1, E2 Figure 4. Device Select Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Write Control (WC) ...
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... Figure 17.TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 19. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 20. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 REVISION HISTORY Table 21. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 M24C16, M24C08, M24C04, M24C02, M24C01 3/28 ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 SUMMARY DESCRIPTION These I²C-compatible electrically erasable pro- grammable memory (EEPROM) devices are orga- nized as 2048/1024/512/256/128 x 8 (M24C16, M24C08, M24C04, M24C02 and M24C01). In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. ECOPACK® packages are Lead-free and RoHS compliant. ...
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... M24Cxx M24Cxx M24C16, M24C08, M24C04, M24C02, M24C01 Write Control (WC). This input signal is useful for protecting the entire contents of the memory from inadvertent write operations. Write opera- tions are disabled to the entire memory array when Write Control (WC) is driven High. When uncon- nected, the signal is internally read as V Write operations are allowed ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 5. Maximum RP Value versus Bus Parasitic Capacitance (C) for an I²C Bus Figure 6. I²C Bus Protocol SCL SDA START Condition SCL MSB SDA START Condition 1 SCL MSB SDA 6/ 100kHz fc = 400kHz 100 C (pF) SDA SDA Input Change ...
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... M24C08 Select Code 1 M24C16 Select Code 1 Note: 1. The most significant bit, b7, is sent first. 2. E0, E1 and E2 are compared against the respective external pins on the memory device. 3. A10, A9 and A8 represent most significant bits of the address. M24C16, M24C08, M24C04, M24C02, M24C01 1 Device Type Identifier ...
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... E2 is not available for devices that need to use address line A10 (see Figure 3. details). Using the E0, E1 and E2 inputs eight M24C02 (or M24C01), four M24C04, two M24C08 or one M24C16 devices can be connect one I²C bus. In each case, and in the hybrid cases, this gives a total memory capacity of 16 Kbits, 2 KBytes (except where M24C01 devic- es are used) ...
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... Table 4. Operating Modes Mode Current Address Read Random Address Read Sequential Read Byte Write Page Write Note Figure 7. Write Mode Sequences with WC=1 (data write inhibited) WC Byte Write WC Page Write WC (cont'd) Page Write (cont'd) M24C16, M24C08, M24C04, M24C02, M24C01 (1) RW bit Bytes ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Write Operations Following a Start condition the bus master sends a Device Select Code with the Read/Write bit (RW) reset to 0. The device acknowledges this, as shown in Figure 8., and waits for an address byte. The device responds to the address byte with an acknowledge bit, and then waits for the data byte ...
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... Figure 8. Write Mode Sequences with WC=0 (data write enabled) WC BYTE WRITE WC PAGE WRITE WC (cont'd) PAGE WRITE (cont'd) M24C16, M24C08, M24C04, M24C02, M24C01 ACK ACK DEV SEL BYTE ADDR DATA IN R/W ACK ACK DEV SEL BYTE ADDR DATA IN 1 R/W ACK ACK ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 9. Write Cycle Polling Flowchart using ACK First byte of instruction with already decoded by the device NO ReSTART STOP Minimizing System Delays by Polling On ACK During the internal Write cycle, the device discon- nects itself from the bus, and writes a copy of the data from its internal latches to the memory cells ...
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... Stop condition. Then, the bus master sends another Start condi- tion, and repeats the Device Select Code, with the Read/Write bit (RW) set to 1. The device acknowl- M24C16, M24C08, M24C04, M24C02, M24C01 ACK NO ACK DEV SEL DATA OUT ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 tion, as shown in Figure 10., without acknowledg- ing the byte. Sequential Read This operation can be used after a Current Ad- dress Read or a Random Address Read. The bus master does acknowledge the data byte output, and sends additional clock pulses so that the de- vice continues to output the next byte in sequence ...
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... LEAD 2. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1=100pF, R1=1500 , R2=500 ). M24C16, M24C08, M24C04, M24C02, M24C01 this specification, is not implied. Exposure to Ab- solute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 DC AND AC PARAMETERS This section summarizes the operating and mea- surement conditions, and the DC and AC charac- teristics of the device. The parameters in the DC and AC Characteristic tables that follow are de- rived from tests performed under the Measure- Table 6. Operating Conditions (M24Cxx-W) ...
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... Note: 1. The voltage source driving only E0, E1 and E2 inputs must provide an impedance of less than 1kOhm. Table 11. AC Measurement Conditions Symbol C Load Capacitance L Input Rise and Fall Times Input Levels Input and Output Timing Reference Levels M24C16, M24C08, M24C04, M24C02, M24C01 Test Condition (in addition to those ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 11. AC Measurement I/O Waveform Table 12. Input Parameters Symbol Parameter C Input Capacitance (SDA Input Capacitance (other pins Input Impedance WCL Z WC Input Impedance WCH Pulse width ignored t NS (Input Filter on SCL and SDA) Note 25° 400kHz A 2 ...
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... Note: 1. For a reSTART condition, or following a Write cycle. 2. Sampled only, not 100% tested avoid spurious START and STOP conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of SDA. 4. This is preliminary information. M24C16, M24C08, M24C04, M24C02, M24C01 Table 6. and Table 11. ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 12. AC Waveforms tCHCL SCL tDLCL SDA In tCHDX START Condition SCL SDA In tCHDH STOP Condition SCL tCLQV SDA Out 20/28 tCLCH tCLDX tDXCX SDA Change SDA Input tW Write Cycle tCLQX Data Valid tCHDH tDHDL STOP START ...
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... Table 15. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data Symbol Typ 3.30 b 0.46 b2 1.52 c 0.25 D 9.27 E 7.87 E1 6.35 e 2. 3.30 M24C16, M24C08, M24C04, M24C02, M24C01 millimeters Min. Max. 5.33 0.38 2.92 4.95 0.36 0.56 1.14 1.78 0.20 0.36 9.02 10 ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 14. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline Note: 1. Drawing is not to scale. 2. The ‘1’ that appears in the top view of the package shows the position of pin 1 and the ‘N’ indicates the total number of pins. ...
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... Table 17. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Data Symbol Typ 0.25 D 2.00 D2 ddd E 3. 0. (number of pins) M24C16, M24C08, M24C04, M24C02, M24C01 D L3 ddd millimeters Min. Max. 0.50 0.60 0.00 0.05 0.20 0.30 1.55 1.65 0.05 0.15 0.25 – – 0.40 0.50 0.15 0.30 ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 16. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline A CP Note: 1. Drawing is not to scale. 2. The circle in the top view of the package indicates the position of pin 1. Table 18. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data Symbol Typ ...
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... Table 19. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Mechanical Data Symbol Typ 0.850 3.000 E 4.900 E1 3.000 e 0.650 CP L 0.550 L1 0.950 M24C16, M24C08, M24C04, M24C02, M24C01 millimeters Min. Max. 1.100 0.050 0.150 0.750 0.950 0.250 0.400 0.130 0.230 2 ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 PART NUMBERING Table 20. Ordering Information Scheme Example: Device Type 2 M24 = I C serial access EEPROM Device Function Kbit (2048 Kbit (1024 Kbit (512 Kbit (256 Kbit (128 x 8) Operating Voltage 2.5 to 5.5V (400 kHz 1.8 to 5.5V (400 kHz) ...
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... Pin numbers removed from silhouettes (see paragraph moved to below SIGNAL 17-Jan-2006 7.0 package specifications updated (see New definition of I M24C16, M24C08, M24C04, M24C02, M24C01 Description of Revision (max) value for -R voltage range corrected. W Device internal reset section, Supply voltage (V DESCRIPTION. Test conditions for V ...
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... M24C16, M24C08, M24C04, M24C02, M24C01 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice ...