M24C02-WBN6P STMicroelectronics, M24C02-WBN6P Datasheet - Page 26

IC EEPROM 2KBIT 400KHZ 8DIP

M24C02-WBN6P

Manufacturer Part Number
M24C02-WBN6P
Description
IC EEPROM 2KBIT 400KHZ 8DIP
Manufacturer
STMicroelectronics
Datasheets

Specifications of M24C02-WBN6P

Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
2K (256 x 8)
Speed
400kHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Organization
256 K x 8
Interface Type
I2C
Maximum Clock Frequency
0.4 MHz
Access Time
900 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.5 V
Maximum Operating Current
2 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
Operating Supply Voltage
6.5 V
Capacitance, Input
8 pF (SDA), 6 pF (Other Pins)
Current, Input, Leakage
±2 μA
Current, Operating
2 mA
Current, Output, Leakage
±2
Data Retention
>40 yrs.
Density
2K
Package Type
PDIP8
Temperature, Operating
-40 to +85 °C
Time, Access
900 ns
Time, Fall
50 ns
Time, Rise
50 ns
Voltage, Esd
4000 V
Voltage, Input, High
3.5 to 6.5 V
Voltage, Input, Low
0.75 to 1.65 V
Voltage, Output, Low
0.4 V
Voltage, Supply
2.5 to 5.5 V
Memory Configuration
256 X 8
Clock Frequency
400kHz
Supply Voltage Range
2.5V To 5.5V
Memory Case Style
DIP
No. Of Pins
8
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-8584-5
M24C02-WBN6P

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M24C02-WBN6P
Manufacturer:
ST
0
Part Number:
M24C02-WBN6P
Manufacturer:
ST
Quantity:
20 000
Part Number:
M24C02-WBN6P (PB)
Manufacturer:
ST
0
Part Number:
M24C02-WBN6P/24C02WP
Manufacturer:
ST
0
M24C16, M24C08, M24C04, M24C02, M24C01
PART NUMBERING
Table 20. Ordering Information Scheme
Example:
Device Type
M24 = I
Device Function
16 = 16 Kbit (2048 x 8)
08 = 8 Kbit (1024 x 8)
04 = 4 Kbit (512 x 8)
02 = 2 Kbit (256 x 8)
01 = 1 Kbit (128 x 8)
Operating Voltage
W = V
R = V
Package
BN = PDIP8
MN = SO8 (150 mil width)
MB = UDFDFPN8 (MLP8)
DW = TSSOP8 (169 mil width)
DS = TSSOP8 (3x3mm² body size, MSOP8)
Device Grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow
3 = Device tested with High Reliability Certified Flow
Automotive temperature range (–40 to 125 °C)
Option
T = Tape and Reel Packing
Plating Technology
blank = Standard SnPb plating
P or G = ECOPACK® (RoHS compliant)
Process
/W or /S = F6SP36%
Note: 1. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment. The High Reliability Cer-
For a list of available options (speed, package,
etc.) or for further information on any aspect of this
device, please contact your nearest ST Sales Of-
fice.
26/28
CC
2. Used only for Device Grade 3.
CC
2
tified Flow (HRCF) is described in the quality note QNEE9801. Please ask your nearest ST sales office for a copy.
C serial access EEPROM
2
= 1.8 to 5.5V (400 kHz)
= 2.5 to 5.5V (400 kHz)
1
.
M24C16
The category of second Level Interconnect is
marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions
are also marked on the inner box label.
W DW 3
T
P
/W

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