SSM6J08FUTE85LF Toshiba, SSM6J08FUTE85LF Datasheet

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SSM6J08FUTE85LF

Manufacturer Part Number
SSM6J08FUTE85LF
Description
MOSFET Vds=-20V Id=-1.3A 6Pin
Manufacturer
Toshiba
Datasheet

Specifications of SSM6J08FUTE85LF

Product Category
MOSFET
Rohs
yes
Transistor Polarity
P-Channel
Drain-source Breakdown Voltage
- 20 V
Continuous Drain Current
- 1.3 A
Resistance Drain-source Rds (on)
140 mOhms
Configuration
Single
Mounting Style
SMD/SMT
Package / Case
ES-6
Power Dissipation
300 mW
Factory Pack Quantity
3000
Power Management Switch
DC-DC Converter
Absolute Maximum Ratings
Marking
Handling Precaution
Small Package
Low on Resistance : R
Low Gate Threshold Voltage
Drain-Source voltage
Gate-Source voltage
Drain current
Drain power dissipation
Channel temperature
Storage temperature range
Note:
Note 1: Mounted on FR4 board
Note 2: The pulse width limited by max channel temperature.
environment is protected against electrostatic electricity. Operators should wear anti-static clothing, and
containers and other objects that come into direct contact with devices should be made of anti-static materials.
When handling individual devices (which are not yet mounted on a circuit board), be sure that the
6
1
K D D
Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(25.4 mm × 25.4 mm × 1.6 t, Cu Pad: 0.32 mm
Characteristics
5
2
4
3
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (U-MOSII)
: R
on
on
DC
Pulse
= 0.18 Ω (max) (@V
= 0.26 Ω (max) (@V
Equivalent Circuit
I
SSM6J08FU
(Ta = 25°C)
DP
P
Symbol
D
V
V
T
(Note 2)
T
GSS
6
1
(Note 1)
I
DS
stg
D
ch
5
2
GS
GS
= −4 V)
= −2.5 V)
−55~150
4
3
Rating
−1.3
−2.6
−20
±12
300
150
2
1
× 6) Fig: 1.
Unit
mW
°C
°C
V
V
A
Fig 1: 25.4 mm × 25.4 mm × 1.6 t,
Cu Pad: 0.32 mm
Weight: 6.8 mg (typ.)
JEDEC
JEITA
TOSHIBA
0.4 mm
SSM6J08FU
2-2J1D
2007-11-01
2
× 6
Unit: mm

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SSM6J08FUTE85LF Summary of contents

Page 1

... Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). ...

Page 2

Electrical Characteristics Characteristics Gate leakage current Drain-Source breakdown voltage Drain Cut-off current Gate threshold voltage Forward transfer admittance Drain-Source ON resistance Input capacitance Reverse transfer capacitance Output capacitance Turn-on time Switching time Turn-off time Note 3: Pulse test Switching Time ...

Page 3

I – −3.0 Common Source −2.5 −10 −4 25°C −2.5 −2.0 −2.0 −1.8 −1.5 −1.0 −1.6 −0 −1 −0.5 −1.0 −1.5 0 Drain-Source voltage V DS (V) R – I ...

Page 4

V – −1.0 Common Source −3 V −0 −0.1 mA −0.6 −0.4 −0.2 0 − 100 Ambient temperature Ta (°C) t – 1000 100 t off ...

Page 5

P – 350 Mounted on FR4 board (25.4 mm × 25.4 mm × 1.6 t, 300 2 × pad: 0.32 mm Fig: 1 250 200 150 100 ...

Page 6

... Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ...

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