BUK7608-55 /T3 NXP Semiconductors, BUK7608-55 /T3 Datasheet

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BUK7608-55 /T3

Manufacturer Part Number
BUK7608-55 /T3
Description
MOSFET TAPE13 PWR-MOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BUK7608-55 /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
55 V
Gate-source Breakdown Voltage
+/- 16 V
Continuous Drain Current
75 A
Resistance Drain-source Rds (on)
0.008 Ohms
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
SOT-404
Fall Time
50 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
187 W
Rise Time
70 ns
Factory Pack Quantity
800
Typical Turn-off Delay Time
100 ns
Part # Aliases
BUK7608-55,118
Philips Semiconductors
GENERAL DESCRIPTION
N-channel
standard level field-effect power
transistor in a plastic envelope
suitable for surface mounting. Using
’trench’
features very low on-state resistance
and has integral zener diodes giving
ESD protection up to 2kV. It is
intended for use in automotive and
general
applications.
PINNING - SOT404
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
ESD LIMITING VALUE
THERMAL RESISTANCES
April 1998
TrenchMOS
Standard level FET
SYMBOL
V
V
I
I
I
P
T
SYMBOL
V
SYMBOL
R
R
D
D
DM
PIN
V
stg
DS
DGR
tot
C
mb
th j-mb
th j-a
1
2
3
GS
, T
j
gate
drain
source
drain
technology
purpose
enhancement
DESCRIPTION
PARAMETER
Drain-source voltage
Drain-gate voltage
Gate-source voltage
Drain current (DC)
Drain current (DC)
Drain current (pulse peak value)
Total power dissipation
Storage & operating temperature
PARAMETER
Electrostatic discharge capacitor
voltage, all pins
PARAMETER
Thermal resistance junction to
mounting base
Thermal resistance junction to
ambient
transistor
the
switching
device
mode
QUICK REFERENCE DATA
PIN CONFIGURATION
SYMBOL
V
I
P
T
R
D
j
DS
tot
DS(ON)
1
2
CONDITIONS
-
R
-
T
T
T
T
-
CONDITIONS
Human body model
(100 pF, 1.5 k )
CONDITIONS
-
Minimum footprint, FR4
board
mb
mb
mb
mb
GS
3
PARAMETER
Drain-source voltage
Drain current (DC)
Total power dissipation
Junction temperature
Drain-source on-state
resistance
= 25 ˚C
= 100 ˚C
= 25 ˚C
= 25 ˚C
= 20 k
1
mb
V
GS
= 10 V
SYMBOL
TYP.
MIN.
MIN.
- 55
50
-
-
-
-
-
-
-
-
-
g
MAX.
Product specification
187
175
55
75
8
MAX.
MAX.
MAX.
240
187
175
0.8
55
55
16
75
65
2
BUK7608-55
-
d
s
Rev 1.000
UNIT
UNIT
UNIT
K/W
K/W
UNIT
kV
W
˚C
m
V
V
V
A
A
A
W
˚C
V
A

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BUK7608-55 /T3 Summary of contents

Page 1

... CONDITIONS - ˚ 100 ˚ ˚ ˚ CONDITIONS Human body model (100 pF, 1 CONDITIONS - Minimum footprint, FR4 board 1 Product specification BUK7608-55 MAX. UNIT 55 75 187 175 SYMBOL MIN. MAX. UNIT - 240 - 187 ...

Page 2

... Measured from source lead soldering point to source bond pad CONDITIONS -dI /dt = 100 - Product specification BUK7608-55 MIN. TYP. MAX. UNIT 3 ...

Page 3

... RDS(ON) = VDS/ID 120 140 160 180 = f & 1E+00 1E-01 1E-02 1E-03 120 140 160 180 Product specification BUK7608-55 MIN. TYP. MAX ˚C mb 1000 100 100 VDS / V Fig.3. Safe operating area ˚ f single pulse; parameter Zth / (K/W) 0 ...

Page 4

... Fig.9. Normalised drain-source on-state resistance -100 Product specification BUK7608- ID f(I ); conditions BUK959-60 Rds(on) normlised to 25degC -100 - 100 Tmb / degC / DS(ON) DS(ON)25 ˚C ...

Page 5

... Ciss Coss Crss 10 100 , Fig.15. Normalised avalanche energy rating. iss oss rss BUK7508-55 VDS = 44V VGS 100 DS 5 Product specification BUK7608-55 Tj/C = 175 0 0 0.2 0.4 0.6 0.8 VSDS/V Fig.14. Typical reverse diode current. = f(V ); conditions parameter T SDS GS WDSS ...

Page 6

... Philips Semiconductors TrenchMOS transistor Standard level FET RD VGS RG 0 Fig.17. Switching test circuit. April 1998 VDD + VDS - T.U.T. 6 Product specification BUK7608-55 Rev 1.000 ...

Page 7

... Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent damage to MOS gate oxide. 2. Epoxy meets UL94 V0 at 1/8". April 1998 10.3 max 11 max 15.4 0.85 max (x2) Fig.18. SOT404 : centre pin connected to mounting base. 11.5 9.0 2.0 3.8 5.08 Fig.19. SOT404 : soldering pattern for surface mounting . 7 Product specification BUK7608-55 4.5 max 1.4 max 2.5 0.5 17.5 Rev 1.000 ...

Page 8

... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. April 1998 8 Product specification BUK7608-55 Rev 1.000 ...

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