NDB6060L_Q Fairchild Semiconductor, NDB6060L_Q Datasheet

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NDB6060L_Q

Manufacturer Part Number
NDB6060L_Q
Description
MOSFET N-Ch LL FET Enhancement Mode
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of NDB6060L_Q

Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
60 V
Gate-source Breakdown Voltage
+/- 16 V
Continuous Drain Current
48 A
Resistance Drain-source Rds (on)
0.025 Ohms
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
TO-263AB
Fall Time
161 ns
Minimum Operating Temperature
- 65 C
Power Dissipation
100 W
Rise Time
320 ns
Typical Turn-off Delay Time
49 ns
Absolute Maximum Ratings
________________________________________________________________________________
© 1997 Fairchild Semiconductor Corporation
Symbol
V
V
V
I
P
T
T
D
NDP6060L / NDB6060L
N-Channel Logic Level Enhancement Mode Field Effect Transistor
DSS
DGR
GSS
D
J
L
These logic level N-Channel enhancement mode power
field effect transistors are produced using Fairchild's
proprietary, high cell density, DMOS technology. This
very high density process has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulses in the
avalanche and commutation modes. These devices are
particularly suited for low voltage applications such as
automotive, DC/DC converters, PWM motor controls,
and other battery powered circuits where fast switching,
low in-line power loss, and resistance to transients are
needed.
General Description
,T
STG
Parameter
Drain-Source Voltage
Drain-Gate Voltage (R
Gate-Source Voltage - Continuous
Drain Current
Total Power Dissipation @ T
Operating and Storage Temperature
Maximum lead temperature for soldering
purposes, 1/8" from case for 5 seconds
- Nonrepetitive (t
Derate above 25°C
- Continuous
- Pulsed
GS
< 1 M )
C
P
= 25°C
< 50 µs)
T
C
= 25°C unless otherwise noted
NDP6060L
Features
48A, 60V. R
Low drive requirements allowing operation directly from logic
drivers. V
Critical DC electrical parameters specified at elevated
temperature.
Rugged internal source-drain diode can eliminate the need
for an external Zener diode transient suppressor.
175°C maximum junction temperature rating.
High density cell design for extremely low R
TO-220 and TO-263 (D
and surface mount applications.
GS(TH)
DS(ON)
-65 to 175
< 2.0V.
± 16
± 25
0.67
144
100
275
60
60
48
= 0.025
2
PAK) package for both through hole
@ V
NDB6060L
G
GS
= 5V.
NDP6060L Rev. D / NDB6060L Rev. E
D
DS(ON)
S
.
April 1996
Units
W/°C
°C
°C
W
V
V
V
A

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NDB6060L_Q Summary of contents

Page 1

... Operating and Storage Temperature J STG Maximum lead temperature for soldering T L purposes, 1/8" from case for 5 seconds © 1997 Fairchild Semiconductor Corporation Features 48A, 60V. R Low drive requirements allowing operation directly from logic drivers. V Critical DC electrical parameters specified at elevated temperature. Rugged internal source-drain diode can eliminate the need for an external Zener diode transient suppressor. 175° ...

Page 2

Electrical Characteristics (T = 25°C unless otherwise noted) C Symbol Parameter DRAIN-SOURCE AVALANCHE RATINGS W Single Pulse Drain-Source Avalanche DSS Energy I Maximum Drain-Source Avalanche Current AR OFF CHARACTERISTICS BV Drain-Source Breakdown Voltage DSS I Zero Gate Voltage Drain Current ...

Page 3

Electrical Characteristics (T = 25°C unless otherwise noted) C Symbol Parameter DRAIN-SOURCE DIODE CHARACTERISTICS I Maximum Continuos Drain-Source Diode Forward Current S Maximum Pulsed Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage SD Reverse Recovery Time t ...

Page 4

Typical Electrical Characteristics 10V GS 6.0 5 DRAIN-SOURCE VOLTAGE (V) DS Figure 1. On-Region Characteristics 24A D 1.75 ...

Page 5

Typical Electrical Characteristics 1. 250µA D 1.1 1.05 1 0.95 0.9 -50 - JUNCTION TEMPERATURE (°C) J Figure 7. Breakdown Voltage Variation with Temperature ...

Page 6

Typical Electrical Characteristics -55°C J 25° 125° DRAIN CURRENT (A) D Figure 13. Transconductance Variation with Drain Current. and Temperature 1 D ...

Page 7

... These larger or intermediate boxes then will b e placed finally inside a labeled shipping box whic h still comes in different sizes depending on the number of units shipped. FSCINT Labe l samp le FAIRCHILD SEMICONDUCTOR CORPORATION HTB:B CBVK741B019 1080 LOT: ...

Page 8

TO-220 Tape and Reel Data and Package Dimensions, continued TO-220 (FS PKG Code 37) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 1.4378 September 1998, Rev. A ...

Page 9

TO-263AB/D 2 PAK Tape and Reel Data and Package Dimensions 2 TO-263AB/D PAK Packaging Configuration: Figure 1.0 Customized Label 2 TO-263AB/D PAK Packaging Information Standard L86Z Packaging Option (no flow code) Packaging type TNR Rail/Tube Qty per Reel/Tube/Bag 800 45 ...

Page 10

TO-263AB/D 2 PAK Tape and Reel Data and Package Dimensions, continued 2 TO-263AB/D PAK Embossed Carrier Tape Configuration: Figure 3 Pkg type O263AB/ 10.60 15.80 24.0 1. PAK +/-0.10 ...

Page 11

TO-263AB/D 2 PAK Tape and Reel Data and Package Dimensions, continued TO-263AB/D 2 PAK (FS PKG Code 45) Scale 1:1 on letter size paper Dimensions shown below are in: Part Weight per unit (gram): 1.4378 1:1 inches [millimeters] August 1998, ...

Page 12

... TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended exhaustive list of all such trademarks. ACEx™ CoolFET™ CROSSVOLT™ CMOS FACT™ FACT Quiet Series™ ® FAST FASTr™ ...

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