IS61LV12824-10BL-TR ISSI, Integrated Silicon Solution Inc, IS61LV12824-10BL-TR Datasheet - Page 12

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IS61LV12824-10BL-TR

Manufacturer Part Number
IS61LV12824-10BL-TR
Description
IC SRAM 3MBIT 10NS 119BGA
Manufacturer
ISSI, Integrated Silicon Solution Inc
Datasheet

Specifications of IS61LV12824-10BL-TR

Format - Memory
RAM
Memory Type
SRAM - Asynchronous
Memory Size
3M (128K x 24)
Speed
10ns
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
119-BGA
Density
3Mb
Access Time (max)
10ns
Sync/async
Asynchronous
Architecture
Not Required
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
3.3V
Address Bus
17b
Package Type
BGA
Operating Temp Range
0C to 70C
Number Of Ports
1
Supply Current
180mA
Operating Supply Voltage (min)
2.97V
Operating Supply Voltage (max)
3.63V
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
119
Word Size
24b
Number Of Words
128K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IS61LV12824-10BL-TR
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Quantity:
10 000
PACKAGING INFORMATION
Plastic Ball Grid Array
Package Code: B (119-pin)
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. B
02/12/03
Sym.
N0.
Leads
A
A1
A2
A3
A4
b
D
D1
D2
E
E1
E2
e
D
21.80
19.40
13.80
11.90
Min.
0.50
0.80
1.30
0.60
MILLIMETERS
20.32 BSC
0.56 BSC
7.62 BSC
1.27 BSC
119
22.20
19.60
14.20
12.10
Max.
2.41
0.70
1.00
1.70
0.90
E2
E
0.858
0.764
0.543
0.469
0.020
0.032
0.051
0.024
Min.
A4
0.022 BSC
0.800 BSC
0.300 BSC
0.050 BSC
INCHES
D2
A3
30ϒ
0.874
0.772
0.559
0.476
0.095
0.028
0.039
0.067
0.035
Max.
A2
1-800-379-4774
A
A1
e
Notes:
1. Controlling dimension: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E do not include mold flash protrusion and
4. Formed leads shall be planar with respect to one another within
should be measured from the bottom of the package.
0.004 inches at the seating plane.
SEATING PLANE
D1
7
6
ISSI
5
E1
4
3 2
φ
b (119X)
1
C
D
G
H
M
N
R
U
A
B
E
F
K
L
P
T
J
®

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