IS42S32800D-6TL ISSI, Integrated Silicon Solution Inc, IS42S32800D-6TL Datasheet - Page 62

• Manufacturer Part Number: IS42S32800D-6TL
• Description: IC SDRAM 256MBIT 166MHZ 86TSOP
• Manufacturer: ISSI, Integrated Silicon Solution Inc
• Type: SDRAMr

Specifications of IS42S32800D-6TL

• Format - Memory: RAM
• Memory Type: SDRAM
• Memory Size: 256M (8Mx32)
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 86-TSOPII
• Organization: 8Mx32
• Density: 256Mb
• Address Bus: 13b
• Access Time (max): 6.5/5.4ns
• Maximum Clock Rate: 166MHz
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 180mA
• Pin Count: 86
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 166 MHz
• Access Time: 6.5 ns, 5.4 ns
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Maximum Operating Current: 180 mA
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PACKAGING INFORMATION
Plastic TSOP 54–Pin, 86-Pin
Package Code: T (Type II)
Integrated Silicon Solution, Inc.
Rev. D
03/13/07
N
1
ZD
No. Leads (N)
Ref. Std.
Symbol
ZD
A1
A2
E1
L1
C
D
A
b
E
e
L
e
Plastic TSOP (T - Type II)
Min
22.02 22.42
10.03 10.29
11.56 11.96
Millimeters
—
—
—
0.71 REF
0.05
0.30
0.12
0.80 BSC
0.40
0°
—
—
Max
1.20
0.15
0.45
0.21
0.60
8°
54
D
—
—
—
Min
0.002 0.006
0.012 0.018
0.005 0.0083
0.867 0.8827
0.395 0.405
0.455 0.471
0.031 BSC
0.016 0.024
0°
Inches
—
—
Max
0.047
8°
N/2+1
b
N/2
E1
A
A1
No. Leads (N)
Ref. Std.
Symbol
E
A1
A2
E1
L1
ZD
A
C
D
E
b
e
L
SEATING PLANE
Plastic TSOP (T - Type II)
Min
Millimeters
22.02 22.42
10.03 10.29
11.56 11.96
—
0.05
0.95
0.17
0.12
0.40
0.80 REF
0°
0.50 BSC
0.61 REF
Notes:
1. Controlling dimension: millimieters,
2. BSC = Basic lead spacing between
3. Dimensions D and E1 do not include
4. Formed leads shall be planar with
unless otherwise specified.
centers.
mold flash protrusions and
measured from the bottom of the
package
respect to one another within 0.004
inches at the seating plane.
L
Max
1.20
0.15
1.05
0.27
0.21
0.60
8°
.
86
—
Min
0.002 0.006
0.037 0.041
0.007 0.011
0.005 0.008
0.867 0.8827
0.395 0.405
0.455 0.471
0.020 BSC
0.016 0.024
0.031 REF
0°
Inches
0.024 BSC
Max
0.047
8°
should be
C
1