ADP3290JCPZ-RL ON Semiconductor, ADP3290JCPZ-RL Datasheet - Page 30

• Manufacturer Part Number: ADP3290JCPZ-RL
• Description: IC CTLR BUCK SW REG 40-LFCSP
• Manufacturer: ON Semiconductor
• Type: Step-Down (Buck)r

Specifications of ADP3290JCPZ-RL

• Internal Switch(s): No
• Synchronous Rectifier: Yes
• Number Of Outputs: 4
• Voltage - Output: 0.5 ~ 1.6 V
• Frequency - Switching: 250kHz ~ 4MHz
• Voltage - Input: 12V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 40-LFCSP
• Output Voltage: 0.5 V to 1.6 V
• Output Current: 500 uA
• Input Voltage: - 0.3 V to + 6.3 V
• Supply Current: 25 mA
• Switching Frequency: 450 kHz
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output: -
• Power - Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

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NOTE 4
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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REFERENCE
PIN 1
INDICATOR
PIN ONE
0.20 C
0.08 C
0.10 C
4X
0.20 C
M
1
e
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
11
40
BOTTOM VIEW
TOP VIEW
SIDE VIEW
H
D1
D2
D
31
A1
(A3)
21
40X
K
E1
E2
A
b
0.10
0.05 C
A
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
B
E
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
4X
C
C
40X
M
LFCSP40 6x6, 0.5P
http://onsemi.com
A
NOTE 3
SEATING
PLANE
CASE 932AC−01
L
B
ISSUE A
30
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
PACKAGE
OUTLINE
4.14
SOLDERING FOOTPRINT*
NOTES:
1
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
0.50
PITCH
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM THE TERMINAL TIP.
PAD AS WELL AS THE TERMINALS.
DIM
A1
A3
D1
D2
E1
E2
M
A
D
E
H
K
b
e
L
MILLIMETERS
MIN
0.80
0.00
0.18
3.95
3.95
0.20
0.30
−−−
−−−
4.14
0.20 REF
6.00 BSC
5.75 BSC
6.00 BSC
5.75 BSC
0.50 BSC
6.30
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
1.00
0.05
0.30
4.25
4.25
0.50
0.60
−−−
12
DIMENSIONS: MILLIMETERS
°
0.28
40X
6.30
0.63
40X
ADP3290/D