STEVAL-IFP007V1 STMicroelectronics, STEVAL-IFP007V1 Datasheet - Page 30
![BOARD EVAL BASED ON SCLT3-8](/photos/9/5/90599/steval-ifp007v1_sml.jpg)
STEVAL-IFP007V1
Manufacturer Part Number
STEVAL-IFP007V1
Description
BOARD EVAL BASED ON SCLT3-8
Manufacturer
STMicroelectronics
Specifications of STEVAL-IFP007V1
Main Purpose
Interface, Digital Signal Termination
Embedded
No
Utilized Ic / Part
SCLT3-8
Primary Attributes
8 Channel Optical Isolation
Secondary Attributes
SPI Interface
Processor To Be Evaluated
SCLT3
Data Bus Width
16 bit
Interface Type
SPI
Operating Supply Voltage
24 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-9045
Package information
5
30/33
Package information
●
●
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
The SCLT3-8 is packaged in the HTSSOP-38 exposed pad that improves the ground cooling
transfer of the input dissipation to the printed board. Increasing the copper surface helps to
reduce any hot point on the board.
Table 13.
38
1
Epoxy meets UL94, V0
Lead-free packages
®
®
packages, depending on their level of environmental compliance. ECOPACK
is an ST trademark.
HTSSOP-38 dimensions
D
P
b
e
20
19
A1
A2
P1
E
A
Doc ID 15191 Rev 3
14°
E1
0.25 mm
L
c
Ø
Ref.
A1
A2
E1
P1
Ø
A
D
E
P
b
e
L
c
Min.
0.05
0.85
0.17
0.09
9.60
4.30
0.50
6.40
3.10
0°
-
-
-
Millimeters
Typ.
9.70
4.40
0.50
6.40
0.60
6.50
3.20
0.9
-
-
-
-
-
Dimensions
Max.
0.15 0.002
0.95 0.033 0.035 0.037
0.27 0.007
0.20 0.003
9.80 0.378 0.382 0.386
4.50 0.169 0.173 0.177
0.70 0.020 0.024 0.027
6.60 0.252 0.256 0.260
3.30 0.122 0.126 0.130
1.1
8°
-
-
Min.
0°
-
-
-
SCLT3-8BT8
Inches
0.020
0.252
Typ.
-
-
-
-
-
0.043
0.006
0.011
0.008
Max.
8°
-
-
®