MCP355XDV-MS1 Microchip Technology, MCP355XDV-MS1 Datasheet - Page 5

BOARD DEV SENSOR APP MCP355X

MCP355XDV-MS1

Manufacturer Part Number
MCP355XDV-MS1
Description
BOARD DEV SENSOR APP MCP355X
Manufacturer
Microchip Technology
Datasheets

Specifications of MCP355XDV-MS1

Number Of Adc's
1
Number Of Bits
22
Data Interface
Serial
Inputs Per Adc
1 Differential
Input Range
±0.3 V
Voltage Supply Source
Single Supply
Operating Temperature
-40°C ~ 125°C
Utilized Ic / Part
MCP355x
Processor To Be Evaluated
MCP355x
Interface Type
RS-232, USB
Lead Free Status / RoHS Status
Not applicable / Not applicable
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Not applicable / Not applicable

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP355XDV-MS1
Manufacturer:
MICROCHIP
Quantity:
12 000
INTRODUCTION
DOCUMENT LAYOUT
© 2006 Microchip Technology Inc.
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
This chapter contains general information that will be useful to know before using the
MCP355X Sensor Application Developer’s Board. Items discussed in this chapter
include:
• Document Layout
• Conventions Used in this Guide
• Recommended Reading
• The Microchip Web Site
• Customer Support
• Document Revision History
This document describes how to use the MCP355X Sensor Application Developer’s
Board as a development tool. The manual layout is as follows:
• Chapter 1. “Product Overview” – Important information about the MCP355X
• Chapter 2. “Hardware Description”– Includes detailed description of the
• Chapter 3. “Firmware Description” – Includes detailed description of the
• Chapter 4. “DataView” - Includes detail description of the DataView software.
• Appendix A. “Schematic and Layouts” – Shows the schematic and layout
• Appendix B. “Bill Of Materials (BOM)” – Lists the parts used to build the
Sensor Application Developer’s Board.
hardware for the MCP355X Sensor Application Developer’s Board.
software for the MCP355X Sensor Application Developer’s Board.
diagrams for the MCP355X Sensor Application Developer’s Board.
MCP355X Sensor Application Developer’s Board
DEVELOPER’S BOARD USER’S GUIDE
NOTICE TO CUSTOMERS
MCP355X SENSOR APPLICATION
Preface
DS51609A-page 1

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