LM3552SDEV National Semiconductor, LM3552SDEV Datasheet - Page 4

• Manufacturer Part Number: LM3552SDEV
• Description: BOARD EVALUATION LM3552SD
• Manufacturer: National Semiconductor
• Series: PowerWise®r

Specifications of LM3552SDEV

• Current - Output / Channel: 700mA
• Outputs And Type: 1, Non-Isolated
• Voltage - Output: 4 V
• Features: Flash Timeout Protection
• Voltage - Input: 2.7 ~ 5.5V
• Utilized Ic / Part: LM3552
• Core Chip: LM3552
• Topology: Boost
• No. Of Outputs: 1
• Output Current: 1A
• Input Voltage: 2.7V To 5.5V
• Development Tool Type: Hardware - Eval/Demo Board
• Mcu Supported Families: LM3552
• Lead Free Status / RoHS Status: Not applicable / Not applicable

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Th
UVP
OVP
V
I
V
I
FTO
SS
FTO
SS
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation
of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions,
see the Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
T
Note 4: For detailed soldering specifications and information, please refer to National Semiconductor Application Note: AN-1187 for Recommended Soldering
Profiles.
Note 5: The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. (MIL-STD-883 3015.7)
Note 6: Maximum recommended SW pin voltage when the OVP pin is grounded.
Note 7: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
dissipation of the device in the application (P
following equation: T
Note 8: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues in board design.
Note 9: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical (Typ) numbers are not guaranteed, but do represent the most likely
norm. Unless otherwise specified, conditions for Typ specifications are: V
Note 10: C
Note 11: Duty cycle affects current limit due to ramp generator.
Note 12: Current limit at 0% duty cycle. See TYPICAL PERFORMANCE section for Switch Current Limit vs. V
Note 13: Bias current flows into FB pin.
Symbol
T/F
J
=120ºC (typ.).
IN
and C
T/F Pin Threshold
Under Voltage Protection
Thresholds
Over Voltage Protection
Thresholds
Flash Timeout trip-point
Flash Timeout Current
Soft-Start Voltage
Soft-Start Current
OUT
A-MAX
,: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics
Parameter
= T
J-MAX-OP
– (θ
JA
A-MAX
× P
D-MAX
D-MAX
) is dependent on the maximum operating junction temperature (T
), and the junction-to-ambient thermal resistance of the part/package in the application (θ
).
On Threshold
Off Threshold
On Threshold
Off Threshold
Output High
Conditions
Output Low
IN
= 3.6V and T
4
A
= 25ºC.
2.25
2.43
11.3
0.99
1.12
1.18
Min
1.2
9.2
10
IN
J-MAX-OP
2.48
2.58
12.4
10.6
1.16
1.25
11.5
Typ
1.4
J
=140ºC (typ.) and disengages at
= 110ºC), the maximum power
Max
2.70
2.77
1.32
1.68
1.32
0.3
14
12
13
JA
), as given by the
Units
µA
µA
V
V
V
V
V