MPC8360E-RDK Freescale Semiconductor, MPC8360E-RDK Datasheet - Page 15

BOARD REFERENCE DESIGN FOR MPC

MPC8360E-RDK

Manufacturer Part Number
MPC8360E-RDK
Description
BOARD REFERENCE DESIGN FOR MPC
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II™ PROr
Type
MPUr
Datasheets

Specifications of MPC8360E-RDK

Contents
Board, Cables, CD, Power Supply
Processor To Be Evaluated
MPC8360E
Data Bus Width
32 bit
Interface Type
RS-232, Ethernet, USB
Operating Supply Voltage
1.3 V
For Use With/related Products
MPC8360E
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Table 6
4
This section provides the clock input DC and AC electrical characteristics for the MPC8360E/58E.
Freescale Semiconductor
DDR I/O
65% utilization
R
R
2 pairs of clocks
Local Bus I/O
Load = 25 pf
3 pairs of clocks
PCI I/O
Load = 30 pF
10/100/1000
Ethernet I/O
Load = 20 pF
Other I/O
s
t
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
= 50 Ω
= 20 Ω
Interface
Clock Input Timing
shows the estimated typical I/O power dissipation for the device.
The rise/fall time on QUICC Engine block input pins should not exceed 5
ns. This should be enforced especially on clock signals. Rise time refers to
signal transitions from 10% to 90% of V
from 90% to 10% of V
200 MHz, 1 × 32 bits
200 MHz, 1 × 64 bits
200 MHz, 2 × 32 bits
266 MHz, 1 × 32 bits
266 MHz, 1 × 64 bits
266 MHz, 2 × 32 bits
333 MHz, 1 × 32 bits
333 MHz, 1 × 64 bits
333 MHz, 2 × 32 bits
133 MHz, 32 bits
83 MHz, 32 bits
66 MHz, 32 bits
50 MHz, 32 bits
33 MHz, 32 bits
66 MHz, 32 bits
MII or RMII
GMII or TBI
RGMII or RTBI
Parameter
Table 6. Estimated Typical I/O Power Dissipation
DD
(1.8 V)
GV
0.35
0.46
0.53
0.81
0.3
0.4
0.6
0.7
0.4
.
DD
(2.5 V)
GV
NOTE
0.46
0.58
0.92
0.56
1.11
0.65
0.82
0.7
1.3
DD
DD
(3.3 V)
OV
0.22
0.14
0.12
0.09
0.05
0.07
; fall time refers to transitions
0.1
DD
(3.3 V)
LV
0.01
0.04
DD
(2.5 V)
LV
0.04
DD
Unit
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
Multiply by
number of
interfaces used.
Clock Input Timing
Comments
15

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