MPC8536DS Freescale Semiconductor, MPC8536DS Datasheet - Page 111

• Manufacturer Part Number: MPC8536DS
• Description: BOARD DEV SYSTEM MPC8536E
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC III™r
• Type: MPUr

Specifications of MPC8536DS

• Contents: Board, Software and Documentation
• Processor Series: MPC85xx
• Core: e500
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 667 MHz
• Operating Supply Voltage: - 0.3 V to + 1.21 V
• Maximum Operating Temperature: + 105 C
• Data Ram Size: 32 KB
• Interface Type: SPI, USB
• Program Memory Type: DDR2, DDR3, SDRAM
• Core Size: 32 Bit
• Program Memory Size: 544KB
• Cpu Speed: 1.5GHz
• Digital Ic Case Style: BGA
• No. Of Pins: 783
• Supply Voltage Range: 0.95V To 1.05V
• Rohs Compliant: Yes
• For Use With/related Products: MPC8536
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2.24.1
This table provides the package thermal characteristics.
Simulations with heat sinks were done with the package mounted on the 2s2p thermal test board. The thermal interface material
was a typical thermal grease such as Dow Corning 340 or Wakefield 120 grease.For system thermal modeling, the chip’s thermal
model without a lid is shown in
of 19.8 W/m•K and a through-plane conductivity of 1.13 W/m•K. The solder balls and air are modeled as a single block
29 x 29 x 0.5 mm with an in-plane conductivity of 0.034 W/m•K and a through plane conductivity of 12.1 W/m•K. The die is
modeled as 9.6 x 9.57 mm with a thickness of 0.75 mm. The bump/underfill layer is modeled as a collapsed thermal resistance
between the die and substrate assuming a conductivity of 7.5 W/m•K in the thickness dimension of 0.07 mm. The die is centered
on the substrate. The thermal model uses approximate dimensions to reduce grid. Please refer to the case outline for actual
dimensions.
2.24.2
This table shows the chip’s thermal model.
Freescale Semiconductor
Junction-to-ambient Natural Convection
Junction-to-ambient Natural Convection
Junction-to-ambient (@200 ft/min)
Junction-to-ambient (@200 ft/min)
Junction-to-board thermal
Junction-to-case thermal
Notes
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per JEDEC JESD51-2 and JESD51-6 with the board (JESD51-9) horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured
4. Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
on the top surface of the board near the package.
(MIL SPEC-883 Method 1012.1) with the calculated case temperature. Actual thermal resistance is less than 0.1 •C/W
Thermal Characteristics
Recommended Thermal Model
MPC8536E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4
Characteristic
Conductivity
Bump/Underfill (9.6 x 9.6 × 0.07 mm) Collapsed Thermal Resistance
Silicon
Figure 72
Kz
Kx
Ky
Kz
Table 79. Package Thermal Characteristics
The substrate is modeled as a block 29 x 29 x 1.2 mm with an in-plane conductivity
Temperature dependent
Substrate (29 × 29 × 1.2 mm)
Table 80. Thermal Model
Die (9.6x9.6 × 0.85 mm)
Value
19.8
19.8
1.13
7.5
Four layer board (2s2p)
Four layer board (2s2p)
Single layer board (1s)
Single layer board (1s)
JEDEC Board
—
—
Symbol
W/m•K
W/m•K
Units
R
R
R
R
R
R
—
θJA
θJA
θJA
θJA
θJB
θJC
Value
< 0.1
23
18
18
14
10
Electrical Characteristics
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Notes
C/W
1, 2
1, 2
1, 2
1, 2
3
4
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