MPC8544COMEDEV Freescale Semiconductor, MPC8544COMEDEV Datasheet - Page 102
MPC8544COMEDEV
Manufacturer Part Number
MPC8544COMEDEV
Description
KIT DEV EXPRESS MPC8544COM
Manufacturer
Freescale Semiconductor
Type
MPUr
Datasheets
1.MPC8544VTALF.pdf
(117 pages)
2.MPC8544VTALF.pdf
(2 pages)
3.MPC8544VTALF.pdf
(1340 pages)
Specifications of MPC8544COMEDEV
Contents
Board
For Use With/related Products
MPC8544
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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Thermal
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure
interface pressure.
The system board designer can choose between several types of thermal interface. There are several
commercially-available thermal interfaces provided by the following vendors:
102
61). Therefore, the synthetic grease offers the best thermal performance, especially at the low
Chomerics, Inc. 781-935-4850
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation800-248-2481
Corporate Center
P.O.Box 999
Midland, MI 48686-0997
Internet: www.dow.com
Shin-Etsu MicroSi, Inc.888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company800-347-4572
18930 West 78
1.5
0.5
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
2
1
0
Figure 63. Thermal Performance of Select Thermal Interface Materials
0
th
St.
10
20
Contact Pressure (psi)
30
40
50
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
60
70
Freescale Semiconductor
80
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