MPC8544COMEDEV Freescale Semiconductor, MPC8544COMEDEV Datasheet - Page 81

• Manufacturer Part Number: MPC8544COMEDEV
• Description: KIT DEV EXPRESS MPC8544COM
• Manufacturer: Freescale Semiconductor
• Type: MPUr

Specifications of MPC8544COMEDEV

• Contents: Board
• For Use With/related Products: MPC8544
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

18 Package Description
This section details package parameters, pin assignments, and dimensions.
18.1
The package parameters for flip chip plastic ball grid array (FC-PBGA) are provided in
Freescale Semiconductor
Package Parameters for the MPC8544E FC-PBGA
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
Package outline
Interconnects
Ball pitch
Ball diameter (typical)
Solder ball (Pb-free)
Note:
1. (FC-PBGA) without a lid.
Table 61. Package Parameters
Parameter
29 mm × 29 mm
96.5% Sn
3.5% Ag
PBGA
0.6 mm
1 mm
783
1
Table
Package Description
61.
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