ST7MDT10-DVP3 STMicroelectronics, ST7MDT10-DVP3 Datasheet - Page 35

• Manufacturer Part Number: ST7MDT10-DVP3
• Description: EMULATOR REAL TIME ST7
• Manufacturer: STMicroelectronics
• Type: Emulatorr

Specifications of ST7MDT10-DVP3

• Contents: Main Emulation Board (MEB), Target Emulation Board (TEB), Cables, Power Supply and Documentation
• For Use With/related Products: ST7 Flash MCUs
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ST7-DVP3 Emulator User Manual
APPENDIX D:GLOSSARY
DIL
ECP (Extended capabilities port communication standard)
EEPROM (Electrically Erasable Programmable Read-Only Memory)
EPP (Enhanced parallel port communication standard)
EPROM (Erasable Programmable Read-Only Memory)
Footprint
I
2
C (Inter-integrated circuit)
Dual In Line. Designates a type of device package with two rows of pins for thru-
hole mounting. Sometimes also called DIP (Dual In-line Package).
A parallel-port standard that supports bi-directional communication between a PC
and a peripheral device.
A non-volatile type of memory that can be erased and reprogrammed by program
instructions. Since no special power supplies or ultra-violet light source is needed,
the contents of this kind of memory can be changed without removing the MCU
from the application system.
A parallel port standard that supports bi-directional communication between a PC
and a peripheral device other than a printer.
A non-volatile type of memory that can be erased by exposure to an ultra-violet
light source. MCUs that have EPROM are easily recognized because the package
has a quartz window to allow exposure to the UV light. If the EPROM MCU is
packaged in an opaque plastic package, it is called a “one-time programmable”
OTP MCU because there is no way to expose the EPROM to a UV light source.
Designates the dimensions of the location of a component on a printed circuit
board or in a socket. It depends on the number of pins, their size, type and
positioning. The footprint of each ST7 device is specified in the datasheet in the
section titled Package Mechanical Data. (Refer to the ST7 MCU FAMILY
DATABOOK or the datasheets provided on the “MCU on CD” CD-ROM).
A protocol for a bus that can be connected to multiple integrated circuits and that
allows any one of them to initiate data transfer.
Appendix D: Glossary
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