DSPIC30F6014A-20E/PT Microchip Technology, DSPIC30F6014A-20E/PT Datasheet - Page 137

• Manufacturer Part Number: DSPIC30F6014A-20E/PT
• Description: IC DSPIC MCU/DSP 144K 80TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6014A-20E/PT

• Program Memory Type: FLASH
• Program Memory Size: 144KB (48K x 24)
• Package / Case: 80-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 68
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 68
• Data Ram Size: 8 KB
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
• Minimum Operating Temperature: - 40 C
• Package: 80TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 3.3|5 V
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 16-chx12-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300024 - KIT DEMO DSPICDEM 1.1XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPDM300004-2 - BOARD DEMO DSPICDEM.NET 2DM300004-1 - BOARD DEMO DSPICDEM.NET 1AC30F007 - MODULE SKT FOR DSPIC30F 80TQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

The following figure depicts the recommended circuit
for the conversion rates above 100 ksps. The
dsPIC30F6014A is shown as an example.
FIGURE 19-2:
The configuration procedures below give the required
setup values for the conversion speeds above 100
ksps.
19.7.1
The following configuration items are required to
achieve a 200 ksps conversion rate.
• Comply with conditions provided in
• Connect external V
• Set SSRC<2.0> = 111 in the ADCON1 register to
• Enable automatic sampling by setting the ASAM
• Write the SMPI<3.0> control bits in the ADCON2
© 2011 Microchip Technology Inc.
the recommended circuit as shown in
enable the auto convert option.
control bit in the ADCON1 register.
register for the desired number of conversions
between interrupts.
C2
0.1 μF
R2
10
V
DD
V
DD
200 KSPS CONFIGURATION
GUIDELINE
C1
0.01 μF
REF
dsPIC30F6011A/6012A/6013A/6014A
ADC VOLTAGE REFERENCE SCHEMATIC
1
2
3
4
5
6
7
8
9
10
V
V
13
14
15
16
17
18
19
20
+ and V
SS
DD
R1
10
REF
- pins following
Table
Figure
V
DD
19-2.
dsPIC30F6014A
19-2.
V
DD
Note 1: Ensure adequate bypass capacitors are provided on each V
V
DD
• Configure the ADC clock period to be:
• Configure the sampling time to be 1 T
The following figure shows the timing diagram of the
ADC running at 200 ksps. The T
tion with the guidelines described above allows a con-
version speed of 200 ksps. See
example.
by writing to the ADCS<5:0> control bits in the
ADCON3 register.
writing: SAMC<4:0> = 00001.
(14 + 1) x 200,000
V
V
60
59
58
57
56
55
54
53
52
50
49
DD
47
46
45
44
43
42
41
SS
1
V
See Note 1:
DD
C8
1 μF
C5
1 μF
V
AV
= 334 ns
DD
AD
DD
Example 19-1
C7
0.1 μF
C4
0.1 μF
selection in conjunc-
DS70143E-page 137
V
AV
DD
AD
DD
C6
0.01 μF
C3
0.01 μF
by
DD
for code
V
AV
DD
pin.
DD