DSPIC30F6014A-20E/PT Microchip Technology, DSPIC30F6014A-20E/PT Datasheet - Page 173

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DSPIC30F6014A-20E/PT

Manufacturer Part Number
DSPIC30F6014A-20E/PT
Description
IC DSPIC MCU/DSP 144K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F6014A-20E/PT

Program Memory Type
FLASH
Program Memory Size
144KB (48K x 24)
Package / Case
80-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
Number Of I /o
68
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
68
Data Ram Size
8 KB
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
Minimum Operating Temperature
- 40 C
Package
80TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Operating Supply Voltage
3.3|5 V
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx12-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300024 - KIT DEMO DSPICDEM 1.1XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPDM300004-2 - BOARD DEMO DSPICDEM.NET 2DM300004-1 - BOARD DEMO DSPICDEM.NET 1AC30F007 - MODULE SKT FOR DSPIC30F 80TQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F6014A-20E/PT
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
DSPIC30F6014A-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
23.0
This section provides an overview of dsPIC30F electrical characteristics. Additional information will be provided in future
revisions of this document as it becomes available.
For detailed information about the dsPIC30F architecture and core, refer to “dsPIC30F Family Reference Manual”
(DS70046).
Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions above
the parameters indicated in the operation listings of this specification is not implied.
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to V
Voltage on V
Voltage on MCLR with respect to V
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports
Note 1:
© 2011 Microchip Technology Inc.
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
2:
ELECTRICAL CHARACTERISTICS
Voltage spikes below V
Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/V
than pulling this pin directly to V
Maximum allowable current is a function of device maximum power dissipation. See
DD
with respect to V
IK
dsPIC30F6011A/6012A/6013A/6014A
OK
(V
DD
SS
I
(V
< 0 or V
pin
O
pin ...........................................................................................................................300 mA
(2)
< 0 or V
...........................................................................................................................250 mA
SS
SS
I
SS
SS
> V
(†)
......................................................................................................... -0.3V to +5.5V
at the MCLR/V
(2)
....................................................................................................... 0V to +13.25V
O
(except V
DD
...............................................................................................................200 mA
> V
) .......................................................................................................... ±20 mA
SS
DD
.
) ................................................................................................... ±20 mA
DD
and MCLR)
PP
pin, inducing currents greater than 80 mA, may cause latchup.
(1)
................................................ -0.3V to (V
Table 23-2
DS70143E-page 173
PP
for P
pin, rather
DD
+ 0.3V)
DMAX
.

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