SX28AC/SS Parallax Inc, SX28AC/SS Datasheet - Page 49

• Manufacturer Part Number: SX28AC/SS
• Description: IC MCU 2K FLASH 50MHZ 28SSOP
• Manufacturer: Parallax Inc
• Series: SXr

Specifications of SX28AC/SS

• Core Processor: RISC
• Core Size: 8-Bit
• Speed: 75MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 20
• Program Memory Size: 3KB (2K x 12)
• Program Memory Type: FLASH
• Ram Size: 136 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 28-SSOP
• Product: Microcontroller Basic Stamps
• Flash: 2 KBytes
• Timers: 8 bit
• Operating Supply Voltage: 3 to 5.5 V
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: No RoHS Version Available

Parallax SX20AC/SX28AC
19.0 MANUFACTURING INFORMATION
19.1. Reflow Peak Temperature
19.2.
Chips shipped in production quantities are MSL3
compliant.
stored in compromised packaging,
remove excess moisture before assembly by baking at
93 °C for 12 hours immediately before commencing
soldering production.
19.3.
All SX part numbers ending in “-G” are certified
Green/RoHS Compliant. The Certificates of Compliance
are appended to this datasheet; full test reports for each
model can be obtained by contacting the Parallax Sales
Team.
19.4. Stress Testing Data Summary
The Parallax SX chip is packaged by a different supplier
than previously used for the Ubicom SX. For this reason
Parallax engaged in a series of stress tests useful for a
change of packaging suppliers. Parallax SX chips
packaged at Greatek in Taiwan were exposed to these
stresses between June and September 2006. The stresses
were provided by a separate stress testing reliability
qualification services firm (Nano Measurements in Santa
Clara, California).
The stress tests chosen are common for a change of
packaging suppliers. The stress testing firm conducted the
tests in accordance with the applicable Joint Electron
Device
guidelines.
Parallax Sales and Tech Support Contact Information
For the latest information on SX programming tools, development boards, compilers, instructional materials, and application
examples, please visit www.parallax.com/sx.
Parallax, Inc.
599 Menlo Drive, Suite 100
Rocklin, CA 95765
© Parallax Inc.
Package Type
Green/RoHS
MSL3 Compliance
Green/RoHS Compliance
Leaded
Engineering
For chips shipped in sample quantities or
Council
Reflow Peak Temp.
235+5/-0 °C
255+5/-0 °C
you may want to
(www.jedec.com)
Page 49 of 51
The following stresses were chosen:
RoHS-compliant and standard chips were exposed to the
stresses separately to further identify if failures would be
associated with a particular package type. Between each
stress, the parts were sent back to Parallax for our
standard production test which exercises the I/O, RAM
and EE/Flash memory, operating voltage and current
draw.
The results are that 100% of the chips passed the Parallax
standard production test, in between and after the stresses
were applied to the chips.
Other stress test data are available upon request from the
Parallax Research and Development team, contact
Parallax Sales or Tech Support.
Sales/Tech Support: [phone]
Toll Free in the US: 1-888-512-1024
Sales: [e-mail]
Tech Support: [e-mail]
• Preconditioning, Level 3, 192 hours 30° C, 60% RH,
• JESD22-A118,
• JESD22-A102, autoclave, 121° C, 100% RH, 15
preflow peak leaded and unleaded (depending on the
package)
110°-130° C, 85% RH, 10-20 PSIG
PSIG, non-biased, 96 hours
SX20AC/SS-G
SX28AC/SS-G
SX28AC/DP-G
SX20AC/SS-G
SX28AC/SS-G
SX28AC/DP-G
Stock Code
SX48BD-G
SX48BD-G
Subtotal
Subtotal
unbiased
Tested
20
20
17
20
77
20
20
17
20
77
HAST
Rev 1.6 11/20/2006
www.parallax.com
192
Passed
20
20
17
20
77
20
20
17
20
77
hours,