HD6413007F20 Renesas Electronics America, HD6413007F20 Datasheet - Page 259
HD6413007F20
Manufacturer Part Number
HD6413007F20
Description
IC H8 MCU ROMLESS 5V 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet
1.D13007F20V.pdf
(798 pages)
Specifications of HD6413007F20
Core Processor
H8/300H
Core Size
16-Bit
Speed
20MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
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Figure 7.15 shows an auto-requested burst-mode transfer. This example shows a transfer of three
words from a 16-bit two-state access area to another 16-bit two-state access area.
When the DMAC is activated from a DREQ pin there is a minimum interval of four states from
when the transfer is requested until the DMAC starts operating*. The DREQ pin is not sampled
during the time between the transfer request and the start of the transfer. In short address mode and
normal mode, the pin is next sampled at the end of the read cycle. In block transfer mode, the pin
is next sampled at the end of one block transfer.
Note: * The minimum response time is also four states when the DMAC is activated by an
φ
Address
bus
RD
HWR
LWR
,
internal module interrupt.
CPU cycle
T
1
T
2
T
d
T
1
Source
address
Figure 7.15 Burst DMA Bus Timing
T
2
T
Destination
address
1
T
2
T
DMAC cycle
1
T
2
Rev.5.00 Sep. 12, 2007 Page 229 of 764
T
1
T
2
T
1
T
2
T
1
7. DMA Controller
REJ09B0396-0500
T
2
T
CPU cycle
1
T
2
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