HD6413007F20 Renesas Electronics America, HD6413007F20 Datasheet - Page 585
HD6413007F20
Manufacturer Part Number
HD6413007F20
Description
IC H8 MCU ROMLESS 5V 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet
1.D13007F20V.pdf
(798 pages)
Specifications of HD6413007F20
Core Processor
H8/300H
Core Size
16-Bit
Speed
20MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
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19. Power-Down State
Section 19 Power-Down State
19.1
Overview
The H8/3006 and H8/3007 have a power-down state that greatly reduces power consumption by
halting the CPU, and a module standby function that reduces power consumption by selectively
halting on-chip modules.
The power-down state includes the following three modes:
• Sleep mode
• Software standby mode
• Hardware standby mode
The module standby function can halt on-chip supporting modules independently of the power-
down state. The modules that can be halted are the 16-bit timer, 8-bit timer, SCI0, SCI1, SCI2,
DMAC, DRAM interface, and A/D converter.
Table 19.1 indicates the methods of entering and exiting the power-down modes and module
standby mode, and gives the status of the CPU and on-chip supporting modules in each mode.
Rev.5.00 Sep. 12, 2007 Page 555 of 764
REJ09B0396-0500
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