DS92LV2421SQE/NOPB National Semiconductor, DS92LV2421SQE/NOPB Datasheet - Page 8

IC SER/DESER 10-75MHZ 24B 48LLP

DS92LV2421SQE/NOPB

Manufacturer Part Number
DS92LV2421SQE/NOPB
Description
IC SER/DESER 10-75MHZ 24B 48LLP
Manufacturer
National Semiconductor
Datasheet

Specifications of DS92LV2421SQE/NOPB

Serdes Function
Serialiser
Ic Input Type
LVCMOS
Ic Output Type
CML
No. Of Inputs
1
No. Of Outputs
1
Supply Voltage Range
1.71V To 1.89V
Driver Case Style
LLP
No. Of Pins
48
Svhc
No SVHC
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
DS92LV2421SQE/NOPBTR

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Part Number
Manufacturer
Quantity
Price
Part Number:
DS92LV2421SQE/NOPB
Manufacturer:
NSC
Quantity:
1 250
Part Number:
DS92LV2421SQE/NOPB
Manufacturer:
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Quantity:
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Pin Name
NC
Channel-Link II — CML Serial Interface
RIN+
RIN-
CMF
ROUT+
ROUT-
Power and Ground (see NOTE below)
VDDL
VDDIR
VDDR
VDDSC
VDDPR
VDDCMLO
VDDIO
GND
NOTE: 1 = HIGH, 0 = LOW
The VDD (V
on the PDB pin is needed to ensure PDB arrives after all the VDD have settled to the recommended operating voltage.
DDn
30, 31, 45,
13, 24, 38
1, 15, 16,
and V
46, 60
43, 55
Pin #
4, 58
DAP
49
50
51
52
53
29
48
57
54
DDIO
) supply ramp should be faster than 1.5 ms with a monotonic rise. If slower then 1.5 ms then a capacitor
I/O, Type
I, Analog
O, CML
O, CML
Ground
I, CML
I, CML
Power
Power
Power
Power
Power
Power
Power
Description
Not Connected
Leave pin open (float)
True Input. The input must be AC Coupled with a 0.1 μF capacitor.
Inverting Input. The input must be AC Coupled with a 0.1 μF capacitor.
Common-Mode Filter
VCM center-tap is a virtual ground which may be ac-coupled to ground to increase receiver
common mode noise immunity. Recommended value is 4.7 μF or higher.
True Output — Receive Signal after the Equalizer
NC if not used or connect to test point for monitor. Requires I2C control to enable.
Inverting Output — Receive Signal after the Equalizer
NC if not used or connect to test point for monitor. Requires I2C control to enable.
Logic Power, 1.8 V ±5%
Input Power, 1.8 V ±5%
RX High Speed Logic Power, 1.8 V ±5%
SSCG Power, 1.8 V ±5%
PLL Power, 1.8 V ±5%
RX High Speed Logic Power, 1.8 V ±5%
LVCMOS I/O Power, 1.8 V ±5% OR 3.3 V ±10% (V
DAP is the large metal contact at the bottom side, located at the center of the LLP package.
Connected to the ground plane (GND) with at least 9 vias.
8
DDIO
)

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