MT48LC8M16A2P-75 IT:G TR Micron Technology Inc, MT48LC8M16A2P-75 IT:G TR Datasheet - Page 6

DRAM Chip SDRAM 128M-Bit 8Mx16 3.3V 54-Pin TSOP-II T/R

MT48LC8M16A2P-75 IT:G TR

Manufacturer Part Number
MT48LC8M16A2P-75 IT:G TR
Description
DRAM Chip SDRAM 128M-Bit 8Mx16 3.3V 54-Pin TSOP-II T/R
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48LC8M16A2P-75 IT:G TR

Density
128 Mb
Maximum Clock Rate
133 MHz
Package
54TSOP-II
Address Bus Width
14 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
6|5.4 ns
Operating Temperature
-40 to 85 °C
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
128M (8Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Package / Case
54-TSOP II
Organization
8Mx16
Address Bus
14b
Access Time (max)
6/5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
150mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
557-1099-2
Figure 57:
Figure 58:
PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAMLOF.fm - Rev. N 1/09 EN
60-Ball FBGA “FB/BB” Package (x8 device), 8mm x 16mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
54-Ball VFBGA “F4/B4” Package (x16 device), 8mm x 8mm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
6
Micron Technology, Inc., reserves the right to change products or specifications without notice.
128Mb: x4, x8, x16 SDRAM
©1999 Micron Technology, Inc. All rights reserved.
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