MPC8309VMAHFCA Freescale Semiconductor, MPC8309VMAHFCA Datasheet - Page 52

• Manufacturer Part Number: MPC8309VMAHFCA
• Description: 417/333/233 MP Std Tmp
• Manufacturer: Freescale Semiconductor

Specifications of MPC8309VMAHFCA

• Processor Series: MPC8309
• Core: e300c3
• Data Bus Width: 32 bit
• Data Ram Size: 512 MB
• Interface Type: USB, CAN, UART, PCI
• Maximum Clock Frequency: 417 MHz
• Number Of Programmable I/os: 56
• Operating Supply Voltage: - 0.3 V to + 1.26 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Operating Temperature Range: 0 C to + 105 C
• Processor To Be Evaluated: MPC8309
• Supply Current (max): 5 uA
• Lead Free Status / Rohs Status: Details

Package and Pin Listings
22 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8309 is available in
a thermally enhanced MAPBGA (mold array process-ball grid array); see
Parameters for the MPC8309,”
for information on the MAPBGA.
22.1
The package parameters are as provided in the following list.
22.2
52
MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 1
Package outline
Package Type
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
The following figure shows the mechanical dimensions and bottom surface nomenclature of the
MPC8309, 489-MAPBGA package.
Package Parameters for the MPC8309
Mechanical Dimensions of the MPC8309 MAPBGA
and
Section 22.2, “Mechanical Dimensions of the MPC8309 MAPBGA,”
19 mm 19 mm
MAPBGA
489
0.80 mm
1.48 mm; Min = 1.31mm and Max 1.61mm
96 Sn / 3.5 Ag / 0.5 Cu (VM package)
0.40 mm
Section 22.1, “Package
Freescale Semiconductor