EP3C25F256C7N Altera, EP3C25F256C7N Datasheet - Page 125

IC CYCLONE III FPGA 256-FBGA

EP3C25F256C7N

Manufacturer Part Number
EP3C25F256C7N
Description
IC CYCLONE III FPGA 256-FBGA
Manufacturer
Altera
Series
Cyclone® IIIr

Specifications of EP3C25F256C7N

Number Of Logic Elements/cells
24624
Number Of Labs/clbs
1539
Total Ram Bits
608256
Number Of I /o
156
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
256-FBGA
Family Name
Cyclone III
Number Of Logic Blocks/elements
24624
# I/os (max)
156
Frequency (max)
437.5MHz
Process Technology
65nm
Operating Supply Voltage (typ)
1.2V
Logic Cells
24624
Ram Bits
608256
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
256
Package Type
FBGA
For Use With
544-2370 - KIT STARTER CYCLONE III EP3C25
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant
Other names
Q4433068

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EP3C25F256C7N
Manufacturer:
ALTERA44
Quantity:
633
Part Number:
EP3C25F256C7N
Manufacturer:
ALTERA
Quantity:
3 513
Part Number:
EP3C25F256C7N
Manufacturer:
Altera
Quantity:
10 000
Part Number:
EP3C25F256C7N
Manufacturer:
ALTERA
0
Part Number:
EP3C25F256C7N
Manufacturer:
ALTERA
Quantity:
200
Part Number:
EP3C25F256C7N
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
Part Number:
EP3C25F256C7NALTERA
Manufacturer:
ALTERA
0
Part Number:
EP3C25F256C7NG
Manufacturer:
ALTERA
0
Part Number:
EP3C25F256C7NG
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
High-Speed I/O Interface
© December 2009
CIII51008-3.2
f
Altera Corporation
This chapter describes the high-speed differential I/O features and resources in the
Cyclone III device family.
High-speed differential I/O standards have become popular in high-speed interfaces
because of their significant advantages over single-ended I/O standards. The Altera
Cyclone
BLVDS, reduced swing differential signaling (RSDS), mini-LVDS, and point-to-point
differential signaling (PPDS).
This chapter contains the following sections:
Cyclone III device family I/Os are separated into eight I/O banks, as shown in
Figure
LVDS, RSDS, mini-LVDS, and PPDS are on the left and right I/O banks. These I/O
standards are also supported on the top and bottom I/O banks using external
resistors. On the left and right I/O banks, some of the differential pin pairs (p and n
pins) of the true output drivers are not located on adjacent pins. In these cases, a
power pin is located between the p and n pins. These I/O standards are also
supported on all I/O banks using two single-ended output with the second output
programmed as inverted, and an external resistor network. True input buffers for
these I/O standards are supported on all I/O banks.
For more information about the location of Cyclone III device family true differential
pins, refer to the
“High-Speed I/O Interface” on page 7–1
“High-Speed I/O Standards Support” on page 7–7
“True Output Buffer Feature” on page 7–15
“High-Speed I/O Timing” on page 7–16
“Design Guidelines” on page 7–17
“Software Overview” on page 7–18
7–1. Each bank has an independent power supply. True output drivers for
®
III device family (Cyclone III and Cyclone III LS devices) supports LVDS,
Cyclone III Devices Pin-Outs
7. High-Speed Differential Interfaces in
the Cyclone III Device Family
on the Altera website.
Cyclone III Device Handbook, Volume 1
®

Related parts for EP3C25F256C7N