MPC8308CVMAFD Freescale Semiconductor, MPC8308CVMAFD Datasheet - Page 88

• Manufacturer Part Number: MPC8308CVMAFD
• Description: MPU POWERQUICC II PRO 473MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8308CVMAFD

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 333MHz
• Voltage: 1V
• Mounting Type: Surface Mount
• Package / Case: 473-MAPBGA
• Product: Network Processor
• Data Rate: 256 bps
• Frequency: 333 MHz
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Supply Current (max): 5 uA
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• Interface: I2C, JTAG, SPI
• Mounting Style: SMD/SMT
• Core Size: 32 Bit
• Cpu Speed: 333MHz
• Digital Ic Case Style: MAPBGA
• No. Of Pins: 473
• Operating Temperature Range: -40°C To +105°C
• Peak Reflow Compatible (260 C): Yes
• Rohs Compliant: Yes
• Leaded Process Compatible: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Document Revision History
25 Document Revision History
Table 63
88
Revision
Rev 2
Rev 1
Rev 0
provides a revision history for this hardware specification.
02/2011
06/2010
05/2010
Date
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 2
Initial release
• Added NV
• In
• In
• In
• In
• In
• In
• In
• In
• In
• In
• In
Added Note-2
Added NV
Added “Extended Temperature range from -40 to 105 °C, in the last row of the table
Changed “characteristic name Junction temperature” to “Operating temperature range”
t
t
Y23 Package Pin Number changed from NC to V
TSEC2_CRS is muxed with GPIO[0], shown as TSEC2_CRS/ GPIO[0]
with 15
TSEC1_TMR_TX_ESFD replaced with TSEC2_TMR_TX_ESFD
TSEC0_TMR_RX_ESFD replaced with TSEC1_TMR_RX_ESFD
TSEC0_TMR_TX_ESFD replaced with TSEC1_TMR_TX_ESFD
DDKHCS
DDKHMP
Table
Table
Table
Figure
Table
Table
Table
Table
Table
Table
Table
2,
4, Note-3, changed ambient temperature to junction temperature, T
18,
53,
58, note-1, core_clk maximum operating frequency 333 MHz replaced with 400 MHz
4, T
8, f
53, TSEC1_TMR_RX_ESFD replaced with TSEC2_TMR_RX_ESFD
56, rows from 1000 to 1111 removed
57, SPMF 5:1 Option 167 MHz added.
changed from 3.15ns to 2.5ns
and t
6, corrected t
DDJ
DDJ
Table 63. Document Revision History
SYS_CLK_IN
A
= 105 replaced with T
DDKHME
to Note-3
to Note-7 in
values updated
DDKHMP
(Max) = 66 replaced with 66.67 and t
Table
& t
1.
DDKHME
Substantive Change(s)
J
= 105
waveform
DD
signal group
SYS_CLK_IN
Freescale Semiconductor
(Min) = 15.15 replaced
J
= 105° C