PSB21150F-V14 Infineon Technologies, PSB21150F-V14 Datasheet - Page 13

PSB21150F-V14

Manufacturer Part Number
PSB21150F-V14
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of PSB21150F-V14

Number Of Line Interfaces
1
Control Interface
HDLC
Lead Free Status / Rohs Status
Supplier Unconfirmed
IPAC-X
PSB/PSF 21150
Overview
1
Overview
The ISDN PC Adapter Circuit Extended IPAC-X integrates all necessary functions for a
host based ISDN access solution on a single chip. It is based on the IPAC PSB 2115,
and provides enhanced features and functionality.
It includes the S-transceiver (Layer 1), an HDLC controller for the D-channel and two
protocol controllers for each B-channel. They can be used for HDLC protocol or
transparent access.
The system integration is simplified by several configurations of the parallel
microcontroller interface selected via pin strapping. They include multiplexed and
demultiplexed interface selection as well as the optional indirect register access
mechanism which reduces the number of necessary registers in the address space to 2
locations. The IPAC-X also provides a serial control interface (SCI).
The FIFO size of the cyclic B-channel buffers is 128 bytes per channel and per direction,
with programmable block size (threshold). Besides TE mode the S-transceiver supports
other terminal relevant operation modes like line termination subscriber side (LT-S) and
line termination trunk side (LT-T). A multi-line ISDN solution to support both S and U line
coding is simplified as well as multi-line solution with up to 3 S-interfaces.
An auxiliary I/O port has been added with interrupt capabilities on two input lines. These
programmable I/O lines may be used to connect peripheral components to the IPAC-X
which need software control or have to forward status information to the host.
Three programmable LED outputs can be used to indicate certain status information,
one of them is capable to indicate the activation status of the S-interface automatically.
The IPAC-X is produced in advanced CMOS technology.
Data Sheet
13
2003-01-30

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