ISL29004IROZ Intersil, ISL29004IROZ Datasheet - Page 13

• Manufacturer Part Number: ISL29004IROZ
• Description: IC SENSOR LIGHT-DGTL I2C 8-ODFN
• Manufacturer: Intersil
• Series: -r

Specifications of ISL29004IROZ

• Wavelength: 550nm
• Output Type: I²C™
• Package / Case: 8-WFDFN Exposed Pad
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Suggested PCB Footprint
Footprint pads should be a nominal 1-to-1 correspondence
with package pads. The large exposed central die-mounting
paddle in the center of the package has no electrical
connection. It is, however, recommended to have the
thermal pad soldered to GND for package reliability.
Layout Considerations
The ISL29004 is relatively insensitive to layout. Like other
I
2
C devices, it is intended to provide excellent performance
REXT1
100K
C1
0.1uF
VDD
FIGURE 6. SUGGESTED PCB FOOTPRINT
MICROCONTROLLER
I2C MASTER
1
2
3
4
I2C SLAVE_44
ISL29004
VDD
GND
REXT
A0
SDA
SCL
R1
10K
R2
10K
SDA
SCL
INT
A1
Dimensions in mm
8
7
6
5
13
C2
0.1uF
REXT2
100K
VDD
1
2
3
4
FIGURE 7. ISL29004 TYPICAL CIRCUIT
I2C SLAVE_45
ISL29004
VDD
GND
REXT
A0
SDA
SCL
INT
A1
8
7
6
5
ISL29004
even in significantly noisy environments. There are only a
few considerations that will ensure best performance.
Route the supply and I
sources of noise. Use two power-supply decoupling
capacitors, 4.7µF and 0.1µF, placed close to the device.
Typical Circuit
A typical application for the ISL29004 is shown in Figure 7.
Additional I
for the ISL29004 so a maximum of four ISL29004 devices
can be tied on the same I
Soldering Considerations
Convection heating is recommended for reflow soldering;
direct-infrared heating is not recommended. The ISL29004’s
plastic ODFN package does not require a custom reflow
soldering profile, and is qualified up to +260°C. A standard
reflow soldering profile with a +260°C maximum is
recommended.
Special Handling
ODFN8 is rated as JEDEC moisture level 4. Standard
JEDEC Level 4 procedure should be followed: 72hr floor life
at less than +30°C 60% RH. When baking the device, the
temperature required is +110°C or less due to its special
molding compound.
C3
0.1uF
REXT3
RES1
VDD
1
2
3
4
I2C SLAVE_46
ISL29004
VDD
GND
REXT
A0
2
C address select pins A0 and A1 are available
SDA
SCL
INT
A1
8
7
6
5
2
C traces as far as possible from all
2
C bus line.
C4
0.1uF
REXT4
RES1
VDD
1
2
3
4
I2C SLAVE_47
ISL29004
VDD
GND
REXT
A0
December 21, 2006
SDA
SCL
INT
A1
8
7
6
5
FN6221.0