STPCD01 STMicroelectronics, STPCD01 Datasheet - Page 51

• Manufacturer Part Number: STPCD01
• Description: STPC CLIENT DATASHEET - PC COMPATIBLE EMBEDED MICROPROCESSOR
• Manufacturer: STMicroelectronics

Figure 5-6. Thermal dissipation with heatsink
Board
Ambient
Case
Junction
Board
Ambient
Rca
Rjc
Rjb
Rba
Board
8.5
Rja = 9.5 C/W
3
Issue 2.2 - October 13, 2000
Junction
Ambient
6
50
Case
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centered on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17 m for internal layers
- 34 m for external layers
Airflow = 0
Board temperature taken at the center balls
Heat sink is 11.1 C/W
MECHANICAL DATA
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