STPCD01 STMicroelectronics, STPCD01 Datasheet - Page 56

• Manufacturer Part Number: STPCD01
• Description: STPC CLIENT DATASHEET - PC COMPATIBLE EMBEDED MICROPROCESSOR
• Manufacturer: STMicroelectronics

BOARD LAYOUT
A local ground plane on opposite side of the board
as shown in Figure 6-6 improves thermal dissipa-
tion. It is used to connect decoupling capacitances
but can also be used for connection to a heat sink
or to the system’s metal box for better dissipation.
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Figure 6-6. Bottom side layout and decoupling
Figure 6-7. Use of metal plate for thermal dissipation
Metal planes
Issue 2.2 - October 13, 2000
Die
This possibility of using the whole system’s box for
thermal dissipation is very usefull in case of high
temperature inside the system and low tempera-
ture outside. In that case, both sides of the PBGA
should be thermally connected to the metal chas-
sis in order to propagate the heat through the met-
al. Figure 6-7 illustrates such an implementation.
Via to ground layer
Ground plane for thermal dissipation
Thermal conductor
Board