MT28F322D20 Micron Technology, MT28F322D20 Datasheet - Page 43

• Manufacturer Part Number: MT28F322D20
• Description: (MT28F322D18 / MT28F322D20) FLASH MEMORY
• Manufacturer: Micron Technology

NOTE: 1. All dimensions in millimeters.
DATA SHEET DESIGNATION
No Mark:
2 Meg x 16 Async/Page/Burst Flash Memory
MT28F322D20FH_4.p65 – Rev. 4, Pub. 7/02
SEATING PLANE
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE
PRE-REFLOW DIAMETER
IS Ø 0.33
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.
Micron and the M logo are registered trademarks and the Micron logo is a trademark of Micron Technology, Inc.
.10 C
58X Ø
This data sheet contains minimum and maximum limits specified over the complete power supply and
temperature range for production devices. Although considered final, these specifications are subject
to change, as further product development and data characterization sometimes occur.
12.00 ± .10
0.35 TYP
BALL A8
6.00 ±0.05
2.25 ±0.05
0.80 ±0.075
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
C
C L
2.625 ±0.05
0.75
TYP
7.00 ±0.10
5.25
C L
3.50 ±0.05
58-BALL FBGA
ASYNC/PAGE/BURST FLASH MEMORY
1.50 (4X)
SUPPORT BALLS
(4X)
0.75
TYP
BALL A1
4.50
43
BALL #1 ID
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2% Ag
SOLDER BALL PAD: Ø .27mm
SUBSTRATE: PLASTIC LAMINATE
ENCAPSULATION MATERIAL: EPOXY NOVOLAC
BALL #1 ID
2 MEG x 16
©2002, Micron Technology, Inc.