se97pw/1 NXP Semiconductors, se97pw/1 Datasheet - Page 26
se97pw/1
Manufacturer Part Number
se97pw/1
Description
Se97 Memory Module Temp Sensor With Integrated Spd
Manufacturer
NXP Semiconductors
Datasheet
1.SE97PW1.pdf
(43 pages)
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NXP Semiconductors
SE97_2
Product data sheet
8.6 Temperature Register (16-bit read-only)
8.7 Manufacturer’s ID register (16-bit read-only)
Table 20.
Table 21.
The SE97 Manufacturer’s ID register is intended to match Philips PCI-SIG (1131h).
Table 22.
Bit
Symbol
Default
Access
Bit
15
14
13
12
11:1
0
Bit
Symbol
Default
Access
Bit
Symbol
Default
Access
Bit
Symbol
Default
Access
Symbol
ACT
AAW
BAW
SIGN
TEMP
RFU
Temperature Register bit allocation
Temperature Register bit description
Manufacturer’s ID register bit allocation
ACT
15
15
R
R
0
0
R
R
7
0
7
0
Description
Above Critical Trip.
Above Alarm Window.
Below Alarm Window.
Sign bit.
Temperature Value (2’s complement). (LSB = 0.125 C)
reserved; always ‘0’
Rev. 02 — 12 October 2007
AAW
14
14
R
R
0 — temperature is below the Critical Alarm Trip Register setting
1 — temperature is equal to or above the Critical Alarm Trip Register
setting
0 — temperature is equal to or below the Upper Boundary Alarm Trip
Register
1 — temperature is above the Alarm window
0 — temperature is equal to or above the Lower Boundary Alarm Trip
Register
1 — temperature is below the Alarm window
0 — positive temperature value
1 — negative temperature value
0
R
0
R
6
0
6
0
BAW
13
13
R
R
0
0
R
R
5
0
5
1
Memory module temp sensor with integrated SPD
SIGN
TEMP
Manufacturer ID
12
12
R
R
0
R
1
R
4
0
4
1
(cont.)
11
11
R
R
0
0
R
R
3
0
3
0
10
10
R
R
0
R
0
R
2
0
2
0
TEMP
© NXP B.V. 2007. All rights reserved.
R
R
9
0
R
9
0
R
1
0
1
0
SE97
RFU
26 of 43
R
R
8
0
8
1
R
R
0
0
0
1
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