se97pw/1 NXP Semiconductors, se97pw/1 Datasheet - Page 41

• Manufacturer Part Number: se97pw/1
• Description: Se97 Memory Module Temp Sensor With Integrated Spd
• Manufacturer: NXP Semiconductors

NXP Semiconductors
15. Revision history
Table 33.
SE97_2
Product data sheet
Document ID
SE97_2
Modifications:
SE97_1
Revision history
Release date
20071012
20070524
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Table 32.
Acronym
SMBus
SO-DIMM
SPD
Section 1 “General
– 1
– 2
– 2
– 4
Table 1 “Ordering
Section 7.3 “EVENT
Section 7.9 “SMBus/I
‘00b’.” to “is set to ‘00h’.”
Figure
Added (new)
Table
Table 27
Figure 27 “EVENT output current”
Table
– changed table title from “SMBus DC characteristics” to “DC characteristics”
– added I
– added I
– I
– I
– I
– I
– removed I
– added I
– added I
(old) Figure 35 and Figure 36 replaced with (new)
devices on the I
“provides 256 bytes of EEPROM memory”
“Placing the Temp Sensor (TS) on a DIMM”
temperature”
between 0.9 V and 3.6 V“
changed from “-” to “+1.0 A”
values for A0, A1, A2 pins
OL(sink)EVENT
LOH
LIH
LIL
st
nd
nd
th
26: removed power dissipation specification
28:
paragraph, 1
paragraph, 1
conditions changed from “V
paragraph, 1
paragraph, 2
20: title modified; added “3.3 V” to topmost signal line (V
conditions changed from “V
: added “EVENT” to conditions; min value changed from (blank) to “ 1.0 A”; max value
“Characteristics”: specifications for I
Abbreviations
DD(AV)
sd(VDD)
L
pd
specification
stb
Figure 21
specification
Data sheet status
Product data sheet
Objective data sheet
2
specification
minimum value changed from “1 mA” to “2 mA”
C-bus”
Description
System Management Bus
Small Outline Dual In-line Memory Module
Serial Presence Detect
specification
specification
information”: topside mark for SE97TK/1 changed from “S97/1” to “97/1”
st
st
description”:
st
nd
output”: added (new) 2
sentence: changed from “provides 256-byte EEPROM of memory” to
sentence: appended “using an open-drain output that can be pulled up
2
sentence: changed from “Placing the Temp Sensor (TS) on DIMM” to
Rev. 02 — 12 October 2007
C-bus
sentence: changed from “the ambient temperate” to “the ambient
…continued
interface”, 1
modified
I
I
= V
= V
Memory module temp sensor with integrated SPD
DD
DD
st
or V
or V
paragraph, 2
nd
DD(AV)
paragraph
SS
Change notice
-
SS
-
” to “SDA, SCL; V
” to “SDA, SCL; V
Figure 36 “Definition of timing for F/S-mode
, I
sd(VDD)
nd
sentence: changed from “is set to
, and I
DD
L
).
I
I
removed from this table
= V
= V
Supersedes
SE97_1
-
SS
DD
”; added condition and
”
© NXP B.V. 2007. All rights reserved.
SE97
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