se97pw/1 NXP Semiconductors, se97pw/1 Datasheet - Page 30

• Manufacturer Part Number: se97pw/1
• Description: Se97 Memory Module Temp Sensor With Integrated Spd
• Manufacturer: NXP Semiconductors

NXP Semiconductors
10. Limiting values
SE97_2
Product data sheet
Calculation example:
Self heating due to power dissipation for HVSON8 is:
Self heating due to power dissipation for TSSOP8 is:
Table 26.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
V
V
I
T
T
sink
T
T
j(max)
stg
DD
n
A0
V
V
I
I
T
I
V
Maximum V
I
V
I
R
R
OL(sink)(SDA)
OL(sink)EVENT
DD(AV)
OL(sink)(SDA)
OL(sink)EVENT
amb
OL(SDA)
OL(EVENT)
DD
OL(EVENT)
th(j-a)
th(j-a)
=
=
56
160
= 3.6 V
(typical temperature inside the notebook) = 50 C
of HVSON8 = 56 C/W
of TSSOP8 = 160 C/W
= 400 A
Parameter
supply voltage
voltage on any other pin
voltage on pin A0
sink current
maximum junction temperature
storage temperature
Limiting values
= LOW-level output voltage on pin SDA
3.6 0.4
= LOW-level output voltage on pin EVENT
= 0.4 V
OL(SDA)
3.6 0.4
= SDA output current LOW
= 1 mA
= EVENT output current LOW
= 3 mA
= 0.4 V
Rev. 02 — 12 October 2007
+
+
0.4 3
0.4 3
+
+
0.4 1
Memory module temp sensor with integrated SPD
0.4 1
Conditions
SDA, SCL, EVENT pins
overvoltage input; A0 pin
at SDA, SCL, EVENT pins
=
=
56 C W
160 C W
3.04 mW
3.04 mV
=
Min
-
0.17 C
=
0.3
0.3
0.3
1
65
© NXP B.V. 2007. All rights reserved.
0.49 C
Max
+4.2
+4.2
12.5
50.0
150
+165
SE97
30 of 43
Unit
V
V
V
mA
C
C
(2)
(3)