se97pw/1 NXP Semiconductors, se97pw/1 Datasheet - Page 43

• Manufacturer Part Number: se97pw/1
• Description: Se97 Memory Module Temp Sensor With Integrated Spd
• Manufacturer: NXP Semiconductors

NXP Semiconductors
18. Contents
1
2
2.1
2.2
2.3
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.3.1
7.3.2
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.10.1
7.10.1.1
7.10.1.2
7.10.1.3
7.10.2
7.10.2.1
7.10.2.2
7.10.2.3
7.10.3
7.10.3.1
7.10.3.2
7.10.3.3
8
8.1
8.2
8.3
8.4
8.5
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Register descriptions . . . . . . . . . . . . . . . . . . . 18
General features . . . . . . . . . . . . . . . . . . . . . . . . 2
Temperature sensor features . . . . . . . . . . . . . . 2
Serial EEPROM features . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 5
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 5
EVENT output. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Alarm window . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Critical trip. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Conversion rate. . . . . . . . . . . . . . . . . . . . . . . . . 7
Power-up default condition . . . . . . . . . . . . . . . . 7
Device initialization . . . . . . . . . . . . . . . . . . . . . . 7
SMBus TIMEOUT . . . . . . . . . . . . . . . . . . . . . . . 8
SMBus Alert Response Address (ARA) . . . . . . 8
SMBus/I
EEPROM operation . . . . . . . . . . . . . . . . . . . . 11
Write operations . . . . . . . . . . . . . . . . . . . . . . . 12
Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Acknowledge polling . . . . . . . . . . . . . . . . . . . . 13
Memory Protection . . . . . . . . . . . . . . . . . . . . . 13
Permanent Write Protection (PWP) . . . . . . . . 14
Reversible Write Protection (RWP) and
Clear Reversible Write Protection (CRWP) . . 15
Read Permanent Write Protection (RPWP),
Read Reversible Write Protection (RRWP),
and Read Clear Reversible Write Protection
(RCRWP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Read operations . . . . . . . . . . . . . . . . . . . . . . . 16
Current address read . . . . . . . . . . . . . . . . . . . 16
Selective read . . . . . . . . . . . . . . . . . . . . . . . . . 16
Sequential read. . . . . . . . . . . . . . . . . . . . . . . . 17
Register overview . . . . . . . . . . . . . . . . . . . . . . 18
Capability Register (00h, 16-bit read-only) . . . 19
Configuration Register (01h, 16-bit read/write) 20
Temperature format . . . . . . . . . . . . . . . . . . . . 23
Temperature Trip Point registers . . . . . . . . . . . 24
2
C-bus interface . . . . . . . . . . . . . . . . . 9
8.5.1
8.5.2
8.5.3
8.6
8.7
8.8
8.9
9
9.1
9.2
9.3
10
11
12
13
13.1
13.2
13.3
13.4
14
15
16
16.1
16.2
16.3
16.4
17
18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Memory module temp sensor with integrated SPD
Application design-in information . . . . . . . . . 28
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 30
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 31
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 36
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 40
Revision history . . . . . . . . . . . . . . . . . . . . . . . 41
Legal information . . . . . . . . . . . . . . . . . . . . . . 42
Contact information . . . . . . . . . . . . . . . . . . . . 42
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Upper Boundary Alarm Trip Register (16-bit
read/write) . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Lower Boundary Alarm Trip Register (16-bit
read/write) . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Critical Alarm Trip Register (16-bit read/write) 25
Temperature Register (16-bit read-only) . . . . 26
Manufacturer’s ID register (16-bit read-only) . 26
Device ID register. . . . . . . . . . . . . . . . . . . . . . 27
SMBus register. . . . . . . . . . . . . . . . . . . . . . . . 27
SE97 in memory module application . . . . . . . 29
Layout consideration . . . . . . . . . . . . . . . . . . . 29
Thermal considerations . . . . . . . . . . . . . . . . . 29
Introduction to soldering. . . . . . . . . . . . . . . . . 38
Wave and reflow soldering . . . . . . . . . . . . . . . 38
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 38
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 39
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 42
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Date of release: 12 October 2007
Document identifier: SE97_2
All rights reserved.
SE97