ADSP-BF538 AD [Analog Devices], ADSP-BF538 Datasheet - Page 50

• Manufacturer Part Number: ADSP-BF538
• Description: Blackfin Embedded Processor
• Manufacturer: AD [Analog Devices]

ADSP-BF538/ADSP-BF538F
THERMAL CHARACTERISTICS
To determine the junction temperature on the application
printed circuit board use:
where:
T
T
center of package.
Ψ
P
the method to calculate P
Values of θ
circuit board design considerations. θ
order approximation of T
where:
T
Values of θ
circuit board design considerations when an external heatsink is
required.
Values of θ
circuit board design considerations.
In
dards JESD51-2 and JESD51-6, and the junction-to-board
measurement complies with JESD51-8. The junction-to-case
measurement complies with MIL-STD-883 (Method 1012.1).
All measurements use a 2S2P JEDEC test board.
Table 36. Thermal Characteristics 316-ball BGA
Parameter
θ
θ
θ
θ
θ
ψ
D
J
CASE
A
JA
JMA
JMA
JB
JC
JT
JT
= Junction temperature ( C)
Table
= Power dissipation (see
= Ambient temperature ( C)
= From
= Case temperature ( C) measured by customer at top
36, airflow measurements comply with JEDEC stan-
JA
JC
JB
Table 36
are provided for package comparison and printed
are provided for package comparison and printed
are provided for package comparison and printed
Condition
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0 linear m/s air flow
T
J
T
=
J
=
T
D
J
CASE
)
T
by the equation:
Power Dissipation on Page 46
A
+
+
(
θ
(
JA
Ψ
JT
×
JA
P
×
can be used for a first
D
P
)
D
Typical
TBD
TBD
TBD
TBD
TBD
TBD
)
Rev. PrD | Page 50 of 56 | May 2006
Unit
C/W
C/W
C/W
C/W
C/W
C/W
for
Preliminary Technical Data