ADSP-BF538 AD [Analog Devices], ADSP-BF538 Datasheet - Page 55

• Manufacturer Part Number: ADSP-BF538
• Description: Blackfin Embedded Processor
• Manufacturer: AD [Analog Devices]

Preliminary Technical Data
SURFACE MOUNT DESIGN
Table 39
standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface Mount Design and Land Pat-
tern Standard.
Table 39. BGA Data for Use with Surface Mount Design
ORDERING GUIDE
1
2
Model
ADSP-BF538BBCZ-4A
ADSP-BF538BBCZ-4F4
ADSP-BF538BBCZ-4F8
ADSP-BF538BBCZ-5A
ADSP-BF538BBCZ-5F4
ADSP-BF538BBCZ-5F8
Package
316-Ball Mini Ball Grid Array
(BC-316)
Z = Pb-free part.
Referenced temperature is ambient temperature.
1
is provided as an aid to PCB design. For industry-
Temperature
Range
–40ºC to +85ºC 400 MHz
–40ºC to +85ºC 400 MHz
–40ºC to +85ºC 400 MHz
–40ºC to +85ºC 500 MHz
–40ºC to +85ºC 500 MHz
–40ºC to +85ºC 500 MHz
Solder Mask Defined 0.40 mm diameter 0.50 mm diameter
Ball Attach Type
2
Instruction
Rate (Max)
Rev. PrD | Page 55 of 56 | May 2006
Solder Mask
Opening
Flash
Memory
NA
512K byte
1M byte
NA
512K byte
1M byte
Operating Voltage
(Nominal)
1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball Mini BGA
1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball Mini BGA
1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball Mini BGA
1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball Mini BGA
1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball Mini BGA
1.2 V internal, 2.5 V or 3.3 V I/O 316-Ball Mini BGA
Ball Pad Size
ADSP-BF538/ADSP-BF538F
Package Description
Package
Option
BC-316
BC-316
BC-316
BC-316
BC-316
BC-316