MM908E622ACDWBR2 FREESCALE [Freescale Semiconductor, Inc], MM908E622ACDWBR2 Datasheet - Page 7

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MM908E622ACDWBR2

Manufacturer Part Number
MM908E622ACDWBR2
Description
Integrated Quad Half-bridge, Triple High Side and EC Glass Driver with Embedded MCU and LIN for High End Mirror
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet
Table 2. Maximum Ratings (continued)
the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
THERMAL RATINGS
Notes
Operating Ambient Temperature
Operating Junction Temperature
Storage Temperature
Peak Package Reflow Temperature During Reflow
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any pin may cause permanent damage to
3.
4.
5.
6.
The limiting factor is junction temperature; taking into account the power dissipation, thermal resistance, and heat sinking.
The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
Rating
(3)
(4)
(5),
(6)
Symbol
T
T
PPRT
T
STG
T
A
J
ELECTRICAL CHARACTERISTICS
- 40 to 125
- 40 to 150
- 40 to 85
Value
Note 6
MAXIMUM RATINGS
Unit
°C
°C
°C
908E622
°C
7

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