MAX11339ATJ+ Maxim Integrated, MAX11339ATJ+ Datasheet - Page 2

• Manufacturer Part Number: MAX11339ATJ+
• Description: Analog to Digital Converters - ADC 10-Bit 8Ch 500ksps SAR ADC
• Manufacturer: Maxim Integrated

Specifications of MAX11339ATJ+

• Rohs: yes
• Number Of Channels: 8
• Architecture: SAR
• Conversion Rate: 500 kSPs
• Resolution: 10 bit
• Input Type: Single-Ended/Differential
• Snr: 61.5 dB
• Interface Type: 3-Wire Serial, Microwire, QSPI, SPI
• Operating Supply Voltage: 3 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: TQFN-EP-32
• Maximum Power Dissipation: 2758 mW
• Minimum Operating Temperature: - 40 C
• Voltage Reference: 2.35 V to 3.6 V

ABSOLUTE MAXIMUM RATINGS
V
AOP, AON, AIP, AIN, OVDD, AIN0–AIN13, CNVST/AIN14, REF+,
CS, SCLK, DIN, DOUT, EOC TO GND .......-0.3V to the lower of
DGND to GND ......................................................-0.3V to +0.3V
Input/Output Current (all pins) ...........................................50mA
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
ELECTRICAL CHARACTERISTICS (MAX11335/MAX11336/MAX11337)
(V
unless otherwise noted. Typical values are at T
Maxim Integrated
DC ACCURACY (Notes 3 and 4)
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Gain Error
Offset Error Temperature Coefficient
Gain Temperature Coefficient
Channel-to-Channel Offset Matching
Line Rejection
DYNAMIC PERFORMANCE (100kHz, Input Sine Wave) (Notes 3 and 7)
Signal-to-Noise Plus Distortion
Signal-to-Noise Ratio
Total Harmonic Distortion
(Up to the 5th Harmonic)
Spurious-Free Dynamic Range
Intermodulation Distortion
Full-Power Bandwidth
Full-Linear Bandwidth
DD
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
DD
REF-/AIN15 to GND ....................................... -0.3V to the lower of
to GND .............................................................-0.3V to +4V
= 2.35V to 3.6V, V
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
500ksps, 12-/10-Bit, 4-/8-/16-Channel ADCs with
PARAMETER
Post-Mux External Signal Conditioning Access
OVDD
= 1.5V to 3.6V, f
(V
OVDD
SYMBOL
(V
JC
SINAD
SFDR
OE
GE
DNL
SNR
THD
RES
PSR
IMD
DD
INL
) ...............1.7NC/W
SAMPLE
JA
TC
TC
+ 0.3V) and +4V
A
+ 0.3V) and +4V
) ...........29NC/W
= +25NC.) (Note 2)
= 500ksps, f
12 bit
No missing codes
(Note 5)
(Note 6)
f
-3dB
-0.1dB
SINAD ≥ 70dB
1
= 99.2432kHz, f
SCLK
CONDITIONS
Continuous Power Dissipation (T
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
= 8MHz, 50% duty cycle, V
TQFN (derate 34.4mW/NC above +70NC)..................2758mW
2
= 69.2139kHz
MAX11335–MAX11340
MIN
REF+
12
70
70
77
A
= V
= +70NC)
-0.02
DD
Q0.8
Q0.5
Q0.3
TYP
71.9
72.3
1.2
-83
-85
0.5
Q2
84
30
5
, T
A
= -40NC to +125NC,
MAX
Q1.0
Q1.0
Q3.0
Q5.5
-76
Q2
ppm/NC
ppm/NC
UNITS
LSB/V
MHz
MHz
LSB
LSB
LSB
LSB
LSB
Bits
dB
dB
dB
dB
dB
2