MAX1302AEUG+ Maxim Integrated, MAX1302AEUG+ Datasheet - Page 12

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MAX1302AEUG+

Manufacturer Part Number
MAX1302AEUG+
Description
Analog to Digital Converters - ADC 16Bit, 8Ch, 4.096V Multi-In Serial ADC
Manufacturer
Maxim Integrated
Datasheet

Specifications of MAX1302AEUG+

Rohs
yes
Number Of Channels
8/4
Architecture
SAR
Conversion Rate
115 kSPs
Resolution
16 bit
Input Type
Single-Ended/Differential
Snr
90 dB
Interface Type
SPI
Operating Supply Voltage
4.75 V to 5.25 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
TSSOP-24
Maximum Power Dissipation
1111.1 mW
Number Of Converters
1
Voltage Reference
4.096 V
8-Channel, ±V
Serial 16-Bit ADC
12
PIN
______________________________________________________________________________________
10
11
12
13
14
15
16
17
18
19
20
1
2
3
4
5
6
7
8
9
REFCAP
DGNDO
DVDDO
AVDD1
SSTRB
NAME
DGND
DOUT
DVDD
SCLK
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
REF
DIN
CS
Analog Supply Voltage 1. Connect AVDD1 to a +4.75V to +5.25V power-supply voltage. Bypass AVDD1
to AGND1 with a 0.1µF capacitor.
Analog Input Channel 0
Analog Input Channel 1
Analog Input Channel 2
Analog Input Channel 3
Analog Input Channel 4
Analog Input Channel 5
Analog Input Channel 6
Analog Input Channel 7
Active-Low Chip-Select Input. When CS is low, data is clocked into the device from DIN on the rising
edge of SCLK. With CS low, data is clocked out of DOUT on the falling edge of SCLK. When CS is high,
activity on SCLK and DIN is ignored and DOUT is high impedance.
Serial Data Input. When CS is low, data is clocked in on the rising edge of SCLK. When CS is high,
transitions on DIN are ignored.
Serial-Strobe Output. When using the internal clock, SSTRB rising edge transitions indicate that data is
ready to be read from the device. When operating in external clock mode, SSTRB is always low. SSTRB
does not tri-state, regardless of the state of CS, and therefore requires
a dedicated I/O line.
Serial Clock Input. When CS is low, transitions on SCLK clock data into DIN and out of DOUT. When CS
is high, transitions on SCLK are ignored.
Serial Data Output. When CS is low, data is clocked out of DOUT with each falling SCLK transition.
When CS is high, DOUT is high impedance.
Digital I/O Ground. DGND, DGNDO, AGND3, AGND2, and AGND1 must be connected together.
Digital Ground. DGND, DGNDO, AGND3, AGND2, and AGND1 must be connected together.
Digital I/O Supply Voltage Input. Connect DVDDO to a +2.7V to +5.25V power-supply voltage. Bypass
DVDDO to DGNDO with a 0.1µF capacitor.
Digital-Supply Voltage Input. Connect DVDD to a +4.75V to +5.25V power-supply voltage. Bypass
DVDD to DGND with a 0.1µF capacitor.
Bandgap-Voltage Bypass Node. For external reference operation, connect REFCAP to AVDD. For
internal reference operation, bypass REFCAP with a 0.01µF capacitor to AGND1 (V
Reference-Buffer Output/ADC Reference Input. For external reference operation, apply an external
reference voltage from 3.800V to 4.136V to REF. For internal reference operation, bypassing REF with a
1µF capacitor to AGND1 sets V
REF
Multirange Inputs,
REF
= 4.096V ±1%.
FUNCTION
Pin Description
REFCAP
≈ 4.096V).

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