CY7C1370D-200BGXC Cypress Semiconductor Corp, CY7C1370D-200BGXC Datasheet - Page 19

• Manufacturer Part Number: CY7C1370D-200BGXC
• Description: IC SRAM 18MBIT 200MHZ 119BGA
• Manufacturer: Cypress Semiconductor Corp
• Type: Synchronousr

Specifications of CY7C1370D-200BGXC

• Memory Size: 18M (512K x 36)
• Package / Case: 119-BGA
• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Speed: 200MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Access Time: 3 ns
• Maximum Clock Frequency: 200 MHz
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3.135 V
• Maximum Operating Current: 300 mA
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Number Of Ports: 4
• Operating Supply Voltage: 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Capacitance
Thermal Resistance
Document Number: 38-05558 Rev. *H
C
C
C
Note
19. Tested initially and after any design or process change that may affect these parameters.
AC Test Loads and Waveforms
OUTPUT
Parameter
IN
CLK
I/O
Parameter
2.5 V I/O Test Load


JA
JC
Z
Input capacitance
Clock input capacitance
Input/output capacitance
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to case)
0
[19]
= 50 
Description
Description
(a)
V
T
= 1.25 V
[19]
R
L
= 50 
OUTPUT
2.5 V
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, per EIA/JESD51.
INCLUDING
T
V
V
A
DD
DDQ
JIG AND
SCOPE
= 25 C, f = 1 MHz,
Test Conditions
5 pF
= 2.5 V,
Test Conditions
= 2.5 V
(b)
R = 1667 
R = 1538 
100 TQFP
100 TQFP
Package
Package
V
GND
28.66
DDQ
4.08
5
5
5
 1 ns
10%
119 BGA
Package
119 BGA
Package
ALL INPUT PULSES
23.8
6.2
8
8
8
90%
(c)
165 FBGA
CY7C1370DV25
CY7C1372DV25
Package
165 FBGA
Package
20.7
4.0
9
9
9
90%
10%
Page 19 of 29
 1 ns
C/W
C/W
Unit
Unit
pF
pF
pF
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