CY7C1370D-200BGXC Cypress Semiconductor Corp, CY7C1370D-200BGXC Datasheet - Page 28

• Manufacturer Part Number: CY7C1370D-200BGXC
• Description: IC SRAM 18MBIT 200MHZ 119BGA
• Manufacturer: Cypress Semiconductor Corp
• Type: Synchronousr

Specifications of CY7C1370D-200BGXC

• Memory Size: 18M (512K x 36)
• Package / Case: 119-BGA
• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Speed: 200MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Access Time: 3 ns
• Maximum Clock Frequency: 200 MHz
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3.135 V
• Maximum Operating Current: 300 mA
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Number Of Ports: 4
• Operating Supply Voltage: 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Document History Page
Document Number: 38-05558 Rev. *H
Document Title: CY7C1370DV25/CY7C1372DV25 18-Mbit (512 K × 36/1 M × 18)
Pipelined SRAM with NoBL™ Architecture
Document Number: 38-05558
REV.
*C
*D
*G
*H
*A
*B
*E
*F
**
ECN No.
2897278
3031731
3050869
3067198
254509
288531
326078
418125
475677
Issue Date
03/22/2010
09/16/2010
10/07/2010
10/20/2010
See ECN
See ECN
See ECN
See ECN
See ECN
Change
Orig. of
NXR
VKN
RKF
SYT
NJY
NJY
NJY
NJY
PCI
New data sheet
Edited description under “IEEE 1149.1 Serial Boundary Scan (JTAG)” for
non-compliance with 1149.1
Removed 225 Mhz Speed Bin
Added lead-free information for 100-Pin TQFP, 119 BGA and 165 FBGA
package
Added comment of ‘Lead-free BG packages availability’ below the Ordering
Information
Address expansion pins/balls in the pinouts for all packages are modified as
per JEDEC standard
Added description on EXTEST Output Bus Tri-State
Changed description on the Tap Instruction Set Overview and Extest
Changed 
4.08 C/W respectively
Changed 
C/W respectively
Changed 
4.0 C/W respectively
Modified V
Removed comment of ‘Lead-free BG packages availability’ below the
Ordering Information
Updated Ordering Information Table
Converted from Preliminary to Final
Changed address of Cypress Semiconductor Corporation on Page# 1 from
“3901 North First Street” to “198 Champion Court”
Changed the description of I
Current on page# 18
Changed the I
to –30 A and 5 A
Changed the I
to –5 A and 30 A
Changed V
Updated Ordering Information Table
Added the Maximum Rating for Supply Voltage on V
Changed t
AC Switching Characteristics table.
Updated the Ordering Information table.
Removed obsolete part numbers from Ordering Information table and
updated package diagrams.
Updated
Added
Minor edits and updated in new template
Removed CY7C1370DV25-167BZI, CY7C1370DV25-250AXC, and
CY7C1370DV25-167AXI parts from
Updated
Acronyms
Ordering Information
Ordering
TH
OL,
JA
JA
IH
JA
, t
and 
< V
and 
X
and 
V
X
TL
OH
current values of MODE on page # 18 from –5 A and 30 A
current values of ZZ on page # 18 from –30 A and 5 A
DD
from 25 ns to 20 ns and t
and
Information.
test conditions
JC
JC
JC
to V
Units of Measure
for BGA Package from 45 and 7 C/W to 23.8 and 6.2
for TQFP Package from 31 and 6 C/W to 28.66 and
for FBGA Package from 46 and 3 C/W to 20.7 and
IH
Description of Change
< V
X
from Input Load Current to Input Leakage
DD
and added
on page # 18
Ordering
Ordering Code Definitions
TDOV
Information.
from 5 ns to 10 ns in TAP
DDQ
CY7C1370DV25
CY7C1372DV25
Relative to GND.
Page 28 of 29
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